公开(公告)号：JPH11312769A

公开(公告)日：1999-11-09

申请号：JP35646398

申请日：1998-12-15

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  ROSSI ROBERTO ,  VILLA CLAUDIO MARIA

IPC: H01L23/36 ,  H01L23/367 ,  H05K1/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a heat sink assembly of a structure, which even when the heat sink assembly is assembled on a general-purpose printed circuit board, which is not of specific specifications, an external heat sink can be soldered to an internal heat sink exposed on the bottom of a device. SOLUTION: An internal heat sink has its exposed parts on the side surfaces of a device package 4. An external heat sink 2 is extendedly provided with its leg parts 9a and 9b directed cling its end parts to a board 7. The end points of these leg parts 9a and 9b come into contact with a solder paste layer 8 on the board 7. When the lalyer 8 is molten in a soldering process, since a molten solder alloy 6 enters into the gaps 10 between the surfaces of the exposed parts of the internal heat sink and the inside surfaces of the leg parts 9a and 9b, the internal heak sink is soldered to the sink 2 and a heat transfer path is formed.

公开(公告)号：DE69728153D1

公开(公告)日：2004-04-22

申请号：DE69728153

申请日：1997-12-16

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  ROSSI ROBERTO ,  VILLA CLAUDIO MARIA

IPC: H01L23/36 ,  H01L23/367 ,  H05K1/02 ,  H05K3/34 ,  H01L23/40

Abstract: An external heat sink (2) may be soldered to a metal slug (3) incorporated at the bottom of a molded body (4) of encapsulating resin of the package of an integrated power device for surface mounting on printed circuit board (7). The metal slug (3) has at least a portion protruding from an outer surface of at least one face of the body (4); an external metal heat sink (2), geometrically coupling with the packaged device over the printed circuit board (7), has at least a surface abutting with a surface of the resin body (4) thus defining a separation gap (10) between at least a surface of said protruding portion of the metal slug (3) and a surface (5, 9a, 9b) opposed to it of the external metal heat sink (2) that gets filled with molten solder alloy (8) during the normal soldering treatment to which the board is subjected.