公开(公告)号：JPH11312769A

公开(公告)日：1999-11-09

申请号：JP35646398

申请日：1998-12-15

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  ROSSI ROBERTO ,  VILLA CLAUDIO MARIA

IPC: H01L23/36 ,  H01L23/367 ,  H05K1/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a heat sink assembly of a structure, which even when the heat sink assembly is assembled on a general-purpose printed circuit board, which is not of specific specifications, an external heat sink can be soldered to an internal heat sink exposed on the bottom of a device. SOLUTION: An internal heat sink has its exposed parts on the side surfaces of a device package 4. An external heat sink 2 is extendedly provided with its leg parts 9a and 9b directed cling its end parts to a board 7. The end points of these leg parts 9a and 9b come into contact with a solder paste layer 8 on the board 7. When the lalyer 8 is molten in a soldering process, since a molten solder alloy 6 enters into the gaps 10 between the surfaces of the exposed parts of the internal heat sink and the inside surfaces of the leg parts 9a and 9b, the internal heak sink is soldered to the sink 2 and a heat transfer path is formed.

公开(公告)号：DE69636853D1

公开(公告)日：2007-03-08

申请号：DE69636853

申请日：1996-11-27

Applicant: ST MICROELECTRONICS SRL

Inventor： FERRI STEFANO ,  ROSSI ROBERTO ,  POINELLI RENATO

IPC: B29C45/26 ,  H01L21/56 ,  B29C45/14 ,  B29L31/34 ,  H01L23/433

Abstract: A method for forming a plastic package (35) for a power semiconductor electronic device to be encapsulated within a plastic case (2) and to be coupled thermally to a heat sink element (25) having a major surface (27) exposed and at least one peripheral portion (36) extending outwards from at least one side of the plastic case (2), of the type wherein it provides for forming the plastic case (2) of the package by molding inside a main cavity (24) of a mold (23) after positioning the heat sink element (25) with this major surface (27) in contact with the bottom of a suitable housing (26) provided in a lower portion of the mold (23) which opens into the main cavity (24) of the mold. According to the invention, the following steps are provided: forming the heat sink element (25) such that at least side surfaces (29) jutting out of said side of the plastic case (2) are, at least in a zone adjacent to that side and in the peripheral portion (36), inclined to form an angle ( alpha ) substantially greater than zero with a normal line (N) to the major surface (27), so as to have a negative slope from outside; correspondingly forming the housing (26) such that its inner walls (28) facing said side surfaces (29) of the heat sink element are inclined, at least in that zone, to form an angle substantially equal to the angle ( alpha ) with the normal line (N), with a positive slope from the housing interior; and providing thrust means (30) which, when the mold (23) is closed, are engaged from above with at least part of the peripheral portion (36) of the heat sink element (25) to exert thereon a compressive force substantially toward the housing (26) bottom and which is effective to hermetically seal temporarily the side surfaces (29) of the heat sink element and the inner walls (28) of the housing in the zone adjacent to said side of the plastic case.

公开(公告)号：DE69728153D1

公开(公告)日：2004-04-22

申请号：DE69728153

申请日：1997-12-16

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  ROSSI ROBERTO ,  VILLA CLAUDIO MARIA

IPC: H01L23/36 ,  H01L23/367 ,  H05K1/02 ,  H05K3/34 ,  H01L23/40

Abstract: An external heat sink (2) may be soldered to a metal slug (3) incorporated at the bottom of a molded body (4) of encapsulating resin of the package of an integrated power device for surface mounting on printed circuit board (7). The metal slug (3) has at least a portion protruding from an outer surface of at least one face of the body (4); an external metal heat sink (2), geometrically coupling with the packaged device over the printed circuit board (7), has at least a surface abutting with a surface of the resin body (4) thus defining a separation gap (10) between at least a surface of said protruding portion of the metal slug (3) and a surface (5, 9a, 9b) opposed to it of the external metal heat sink (2) that gets filled with molten solder alloy (8) during the normal soldering treatment to which the board is subjected.

公开(公告)号：DE69627643D1

公开(公告)日：2003-05-28

申请号：DE69627643

申请日：1996-06-28

Applicant: ST MICROELECTRONICS SRL

Inventor： FERRI STEFANO ,  ROSSI ROBERTO

IPC: B29C45/14 ,  H01L21/56 ,  H01L23/433 ,  H01L23/28

公开(公告)号：DE69636853T2

公开(公告)日：2007-11-08

申请号：DE69636853

申请日：1996-11-27

Applicant: ST MICROELECTRONICS SRL

Inventor： FERRI STEFANO ,  ROSSI ROBERTO ,  POINELLI RENATO

IPC: B29C45/26 ,  H01L21/56 ,  B29C45/14 ,  B29L31/34 ,  H01L23/433

Abstract: A method for forming a plastic package (35) for a power semiconductor electronic device to be encapsulated within a plastic case (2) and to be coupled thermally to a heat sink element (25) having a major surface (27) exposed and at least one peripheral portion (36) extending outwards from at least one side of the plastic case (2), of the type wherein it provides for forming the plastic case (2) of the package by molding inside a main cavity (24) of a mold (23) after positioning the heat sink element (25) with this major surface (27) in contact with the bottom of a suitable housing (26) provided in a lower portion of the mold (23) which opens into the main cavity (24) of the mold. According to the invention, the following steps are provided: forming the heat sink element (25) such that at least side surfaces (29) jutting out of said side of the plastic case (2) are, at least in a zone adjacent to that side and in the peripheral portion (36), inclined to form an angle ( alpha ) substantially greater than zero with a normal line (N) to the major surface (27), so as to have a negative slope from outside; correspondingly forming the housing (26) such that its inner walls (28) facing said side surfaces (29) of the heat sink element are inclined, at least in that zone, to form an angle substantially equal to the angle ( alpha ) with the normal line (N), with a positive slope from the housing interior; and providing thrust means (30) which, when the mold (23) is closed, are engaged from above with at least part of the peripheral portion (36) of the heat sink element (25) to exert thereon a compressive force substantially toward the housing (26) bottom and which is effective to hermetically seal temporarily the side surfaces (29) of the heat sink element and the inner walls (28) of the housing in the zone adjacent to said side of the plastic case.

公开(公告)号：IT201700053915A1

公开(公告)日：2018-11-18

申请号：IT201700053915

申请日：2017-05-18

Applicant: ST MICROELECTRONICS SRL

Inventor： ROSSI ROBERTO