公开(公告)号：WO2015160718A3

公开(公告)日：2015-10-22

申请号：PCT/US2015/025604

申请日：2015-04-13

Applicant: STARLITE LED INC.

Inventor： CHEN, Pao ,  CHANG, Chung Chi ,  HAN, Chang

IPC: H01L33/10 ,  H01L51/50 ,  H01L51/56

Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.

公开(公告)号：WO2017065766A1

公开(公告)日：2017-04-20

申请号：PCT/US2015/055570

申请日：2015-10-14

Applicant: STARLITE LED INC.

Inventor： CHEN, Pao ,  HAN, Sang

IPC: H01L33/44

CPC classification number: H01L25/0753 ,  A01G7/045 ,  H01L33/32 ,  H01L33/504 ,  H01L33/62 ,  H01L33/642 ,  H05B33/0803 ,  H05B33/0857 ,  H05K1/05 ,  H05K3/284 ,  H05K2201/09054 ,  H05K2201/10106 ,  Y02P60/149

Abstract: Techniques for providing plant growth lights with improved performance and cost are discussed herein. Some embodiments may provide for a light emitting diode (LED) flip chip chip-on-board (COB) module for optimizing plant growth, including: a circuit board; ultraviolet (UV) LED flip chips connected to the circuit board; a royal-blue phosphor or fluorescent layer covering a first portion of the UV LED flip chips; and a deep-red phosphor or fluorescent layer covering a second portion of the UV LED flip chips. The royal-blue phosphor or fluorescent layer absorbs UV light generated by the first portion of the UV LED flip chips and converts the UV light into broad-band light in royal-blue spectrums. The a deep-red phosphor or fluorescent layer absorbs UV light generated by the second portion of the UV LED flip chips and converts the UV light into broad-band light in deep-red spectrums.

Abstract translation: 这里讨论了用于提供具有改进的性能和成本的植物生长灯的技术。 一些实施例可以提供用于优化植物生长的发光二极管（LED）倒装芯片板上芯片（COB）模块，其包括：电路板; 紫外（UV）LED倒装芯片连接到电路板; 覆盖UV LED倒装芯片的第一部分的皇家蓝色磷光体或荧光层; 以及覆盖UV LED倒装芯片的第二部分的深红色磷光体或荧光层。 皇家蓝色磷光体或荧光层吸收由第一部分UV LED倒装芯片产生的UV光，并将该UV光转换为皇家蓝色光谱中的宽带光。 深红色磷光体或荧光层吸收由第二部分UV LED倒装芯片产生的UV光并将UV光转换为深红色光谱中的宽带光。

公开(公告)号：WO2016186667A1

公开(公告)日：2016-11-24

申请号：PCT/US2015/031817

申请日：2015-05-20

Applicant: STARLITE LED INC.

Inventor： CHEN, Pao ,  CHANG, Chung Chi

IPC: H01L33/48

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/644

Abstract: A multi-die light emitting diode (LED) module that includes an LED chip and a metal core printed circuit board (MCPCB). The LED chip may include a substrate and multiple LED dies formed on the substrate. The multiple LED dies may be electrically connected with each other using conductive bridges, and may interface with the MCPCB through two contact pads. A planar chip passivation layer may be disposed on the conductive bridges and the LED dies. Two contact pads providing external electrical connections for the LED chip may be formed on the planar chip passivation layer, and bonded to PCB bonding pads of the MCPCB. Some embodiments may further provide for improved thermal dissipation for a multi-die LED module. For example, a thermal pad may also be disposed on the surface of the planar chip passivation layer and bonded to a PCB bonding pad disposed on substrate mesa structure of the MCPCB.

Abstract translation: 一种包括LED芯片和金属芯印刷电路板（MCPCB）的多模发光二极管（LED）模块。 LED芯片可以包括基板和形成在基板上的多个LED管芯。 多个LED管芯可以使用导电桥彼此电连接，并且可以通过两个接触焊盘与MCPCB连接。 平面芯片钝化层可以设置在导电桥和LED管芯上。 提供用于LED芯片的外部电连接的两个接触焊盘可以形成在平面芯片钝化层上，并且结合到MCPCB的PCB焊盘。 一些实施例可以进一步提供用于多管芯LED模块的改进的散热。 例如，散热焊盘也可以设置在平面芯片钝化层的表面上并且结合到设置在MCPCB的衬底台面结构上的PCB焊盘。