公开(公告)号：WO2015160718A3

公开(公告)日：2015-10-22

申请号：PCT/US2015/025604

申请日：2015-04-13

Applicant: STARLITE LED INC.

Inventor： CHEN, Pao ,  CHANG, Chung Chi ,  HAN, Chang

IPC: H01L33/10 ,  H01L51/50 ,  H01L51/56

Abstract: A method of fabricating a light emitting diode device comprises depositing conductive material to cover a portion of surface of a conductive and reflective layer to form a first contact pad, and surfaces between adjacent first trenches to form a second contact pad; and depositing a first passivation layer over uncovered portion of surface of the conductive and reflective layer to form a first planar passivation contact surface between the first contact pad and the second trench and depositing bonding material to cover a portion of surface of the first contact pad, a portion of the second contact pad and a portion of the first planar passivation contact to form a first light emitting diode bonding pad on the first contact pad, a second light emitting diode bonding pad on the second contact pad, and a third light emitting diode bonding pad on the first planar passivation contact.