SOLAR PANEL MODULE AND METHOD FOR MANUFACTURING SUCH A SOLAR PANEL MODULE
    1.
    发明申请
    SOLAR PANEL MODULE AND METHOD FOR MANUFACTURING SUCH A SOLAR PANEL MODULE 审中-公开
    太阳能电池组件和用于制造这种太阳能电池组件的方法

    公开(公告)号:WO2011084053A3

    公开(公告)日:2011-12-29

    申请号:PCT/NL2011050004

    申请日:2011-01-05

    Abstract: A solar panel module includes a transparent carrier and semi-conductor substrate portions that have a front surface and a rear surface. The front surface is arranged for capturing radiation energy. The semiconductor substrate portions are arranged adjacent to each other on the transparent carrier and are separated from each other by a groove. Each semiconductor substrate portion is attached with the front surface to the transparent carrier. Each groove includes a side wall of each of the adjacent semiconductor substrate portions. The front surface of each semiconductor substrate portion is provided with a doped layer of a first conductivity type. Each semiconductor substrate portion includes a first electric contact for minority charge carriers and a second electric contact for majority charge carriers in the semiconductor substrate portion. The first electric contact is arranged on at least the rear surface of the semiconductor substrate portion as a heterostructure of a first type. The hetero junction of the first type includes an intrinsic semiconductor layer on the semiconductor substrate portion and a semiconductor layer of a second conductivity type, opposite to the first conductivity type,on top of the intrinsic semiconductor layer.

    Abstract translation: 太阳能板模块包括透明载体和具有前表面和后表面的半导体衬底部分。 前表面被布置用于捕获辐射能量。 半导体衬底部分在透明载体上彼此相邻地布置并且通过凹槽彼此分开。 每个半导体衬底部分以前表面附着到透明载体。 每个凹槽包括每个相邻半导体衬底部分的侧壁。 每个半导体衬底部分的前表面设置有第一导电类型的掺杂层。 每个半导体衬底部分包括用于少数电荷载流子的第一电触点和用于半导体衬底部分中的多数电荷载流子的第二电触点。 第一电触点作为第一类型的异质结构至少设置在半导体衬底部分的后表面上。 第一类异质结包括在本征半导体层上的半导体衬底部分上的本征半导体层和与第一导电类型相反的第二导电类型的半导体层。

    SOLAR PANEL MODULE AND METHOD FOR MANUFACTURING SUCH A SOLAR PANEL MODULE.

    公开(公告)号:NL2004065C2

    公开(公告)日:2011-07-07

    申请号:NL2004065

    申请日:2010-01-06

    Abstract: A solar panel module includes a transparent carrier and semi-conductor substrate portions that have a front surface and a rear surface. The front surface is arranged for capturing radiation energy. The semiconductor substrate portions are arranged adjacent to each other on the transparent carrier and are separated from each other by a groove. Each semiconductor substrate portion is attached with the front surface to the transparent carrier. Each groove includes a side wall of each of the adjacent semiconductor substrate portions. The front surface of each semiconductor substrate portion is provided with a doped layer of a first conductivity type. Each semiconductor substrate portion includes a first electric contact for minority charge carriers and a second electric contact for majority charge carriers in the semiconductor substrate portion. The first electric contact is arranged on at least the rear surface of the semiconductor substrate portion as a heterostructure of a first type. The hetero junction of the first type includes an intrinsic semiconductor layer on the semiconductor substrate portion and a semiconductor layer of a second conductivity type, opposite to the first conductivity type, on top of the intrinsic semiconductor layer.

    SOLAR CELL AND METHOD FOR MANUFACTURING SUCH A SOLAR CELL.

    公开(公告)号:NL2010496C2

    公开(公告)日:2014-09-24

    申请号:NL2010496

    申请日:2013-03-21

    Abstract: A solar cell including a semiconductor substrate, having a front side surface for receiving radiation and back-side surface providing a first junction structure in a first area substrate portion and with a second junction structure in a second area substrate portion. The second area portion borders the first area portion. The first junction structure includes a first conductivity type semiconductor layer covering the first area portion. The second junction structure includes a second conductivity type semiconductor layer covering the second area portion. The second junction structure, second conductivity type semiconductor layer partially overlaps the first junction structure, first conductivity type semiconductor layer, with the overlapping second conductivity type semiconductor layer portion being above a first conductivity type semiconductor layer portion while separated by a first dielectric layer. The first conductivity type semiconductor layer portion under the overlapping second conductivity type semiconductor layer portion directly contacts the semiconductor substrate surface.

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