DISPOSITIF DE REFROIDISSEMENT D UN CIRCUIT INTEGRE
    1.
    发明公开
    DISPOSITIF DE REFROIDISSEMENT D UN CIRCUIT INTEGRE 审中-公开
    COOLER用于电路板

    公开(公告)号:EP1687535A1

    公开(公告)日:2006-08-09

    申请号:EP04805827.5

    申请日:2004-11-12

    Abstract: The invention relates to a pump comprising: a cavity formed inside an insulating substrate, the upper part of the substrate being situated near the cavity comprising an edge; a conductive layer covering the inside of the cavity up to the edge and optionally covering the edge itself; a flexible membrane made of a conductive material placed above the cavity and resting against the edge; a dielectric layer covering the conductive layer or the membrane whereby insulating the portions of the conductive layer and of the membrane that are near one another; at least one aeration line formed in the insulating substrate that opens into the cavity via an opening in the conductive layer, and; terminals for applying a voltage between the conductive layer and the membrane.

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