Insulated gate semiconductor device with optimized breakdown voltage and manufacturing method thereof
    1.
    发明公开
    Insulated gate semiconductor device with optimized breakdown voltage and manufacturing method thereof 审中-公开
    具有改善的击穿电压及其制造方法绝缘栅半导体器件

    公开(公告)号:EP2551910A1

    公开(公告)日:2013-01-30

    申请号:EP12178140.5

    申请日:2012-07-26

    Abstract: An insulated gate semiconductor device (30; 60; 90; 100; 150), comprising: a semiconductor body (32, 34, 36; 102, 104, 106) having a front side (32a; 36a; 106a) and a back side (32b; 102b) opposite to one another; a drift region (36; 106'), which extends in the semiconductor body and has a first type of conductivity and a first doping value; a body region (38; 108; 156) having a second type of conductivity, which extends in the drift region facing the front side of the semiconductor body; a source region (40; 113), which extends in the body region and has the first type of conductivity; and a buried region (44; 114) having the second type of conductivity, which extends in the drift region at a distance from the body region and at least partially aligned to the body region in a direction (Z) orthogonal to the front side and to the back side.

    Abstract translation: 一种绝缘栅半导体器件(30; 60; 90; 100; 150),包括:半导体主体(32,34,36; 102,104,106)具有前侧(32A; 36A; 106A)和背面 (32B; 102B)彼此相对; 的漂移区(36; 106“),其在半导体本体延伸,并且具有第一导电类型和第一掺杂值; (38; 108; 156)是具有第二型导电性的,它在朝向半导体本体的前侧的漂移区延伸的体区; 一个源极区(40; 113),其中在所述主体区域延伸,并且具有第一导电类型的; 和埋入区(44; 114)具有第二导电类型,其中在所述漂移区在从所述主体区域的距离延伸,并且至少部分地对准到主体区的方向(Z)正交于所述前侧和 到背面。

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