A non-volatile memory device
    1.
    发明公开
    A non-volatile memory device 有权
    NichtflüchtigeSpeicherannnung

    公开(公告)号:EP1345236A1

    公开(公告)日:2003-09-17

    申请号:EP02425152.2

    申请日:2002-03-14

    CPC classification number: G11C16/10 G11C2216/20 G11C2216/22

    Abstract: A non-volatile memory device (120) is proposed. The non-volatile memory device includes a flash memory (205) and means (225) for executing external commands, the external commands including a first subset of commands for accessing the flash memory directly; the memory device further includes a programmable logic unit (245) and means (250) for storing program code for the logic unit, the external commands including a second subset of at least one command for causing the logic unit to process information stored in at least one portion of the flash memory under the control of the program code.

    Abstract translation: 提出了一种非易失性存储器件(120)。 非易失性存储器件包括用于执行外部命令的闪速存储器(205)和装置(225),所述外部命令包括用于直接访问闪速存储器的第一命令子集; 所述存储装置还包括可编程逻辑单元(245)和用于存储所述逻辑单元的程序代码的装置(250),所述外部命令包括用于使所述逻辑单元处理至少存储的信息的至少一个命令的第二子集 一部分闪存在程序代码的控制之下。

    Integrated semiconductor optic sensor device and corresponding manufacturing process
    2.
    发明公开
    Integrated semiconductor optic sensor device and corresponding manufacturing process 审中-公开
    半导体光集成传感器组件及其制造方法

    公开(公告)号:EP1073125A3

    公开(公告)日:2003-10-08

    申请号:EP00104800.8

    申请日:2000-03-06

    CPC classification number: H01L31/02165 G01J2003/516

    Abstract: The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including at least the following phases: implanting active areas on a semiconductor substrate to obtain at least a first integrated region of a corresponding photosensor; forming at least a stack of layers having different thickness and refractive index layers over the photosensor to provide interferential filters for the same photosensor. At least one of the above mentioned layers is formed by a trasparent metallic oxide having a high refraction index and a corresponding high dielectric constant. In this manner, the design of interferential resonators is rendered more flexible making possible the use of a stack of layers including more than one high refraction index layer.

    Integrated semiconductor optic sensor device and corresponding manufacturing process
    3.
    发明公开
    Integrated semiconductor optic sensor device and corresponding manufacturing process 审中-公开
    Integrierte optische Halbleitersensoranordnung und deren Herstellungsverfahren

    公开(公告)号:EP1073125A2

    公开(公告)日:2001-01-31

    申请号:EP00104800.8

    申请日:2000-03-06

    CPC classification number: H01L31/02165 G01J2003/516

    Abstract: The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including at least the following phases: implanting active areas on a semiconductor substrate to obtain at least a first integrated region of a corresponding photosensor; forming at least a stack of layers having different thickness and refractive index layers over the photosensor to provide interferential filters for the same photosensor. At least one of the above mentioned layers is formed by a trasparent metallic oxide having a high refraction index and a corresponding high dielectric constant.
    In this manner, the design of interferential resonators is rendered more flexible making possible the use of a stack of layers including more than one high refraction index layer.

    Abstract translation: 本发明涉及一种用于制造标准CMOS工艺中的光传感器装置的方法,至少包括以下阶段:在半导体衬底上注入有源区域以获得相应的光电传感器的至少第一集成区域; 在光传感器上形成具有不同厚度和折射率层的至少一叠层,以为相同的光传感器提供干涉滤光器。 上述层中的至少一层由具有高折射率和相应的高介电常数的透明金属氧化物形成。 以这种方式,使干涉谐振器的设计变得更加灵活,使得可能使用包括多于一个高折射率层的层叠层。

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