Abstract:
A non-volatile memory device (120) is proposed. The non-volatile memory device includes a flash memory (205) and means (225) for executing external commands, the external commands including a first subset of commands for accessing the flash memory directly; the memory device further includes a programmable logic unit (245) and means (250) for storing program code for the logic unit, the external commands including a second subset of at least one command for causing the logic unit to process information stored in at least one portion of the flash memory under the control of the program code.
Abstract:
The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including at least the following phases: implanting active areas on a semiconductor substrate to obtain at least a first integrated region of a corresponding photosensor; forming at least a stack of layers having different thickness and refractive index layers over the photosensor to provide interferential filters for the same photosensor. At least one of the above mentioned layers is formed by a trasparent metallic oxide having a high refraction index and a corresponding high dielectric constant. In this manner, the design of interferential resonators is rendered more flexible making possible the use of a stack of layers including more than one high refraction index layer.
Abstract:
The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including at least the following phases: implanting active areas on a semiconductor substrate to obtain at least a first integrated region of a corresponding photosensor; forming at least a stack of layers having different thickness and refractive index layers over the photosensor to provide interferential filters for the same photosensor. At least one of the above mentioned layers is formed by a trasparent metallic oxide having a high refraction index and a corresponding high dielectric constant. In this manner, the design of interferential resonators is rendered more flexible making possible the use of a stack of layers including more than one high refraction index layer.