Abstract:
A memory device includes a group (11, 17) of memory cells (12) organized in rows and columns and a first addressing circuit (14, 15) for addressing said memory cells (12) of said group (11, 17) on the basis of a cell address (ADD, AWL, ABL). The device further includes a plurality of sets of reference cells (19, 24), associated to the group (11, 17), each of said set having a plurality of reference cells (25a-25c, 26a-26c, 27, 28), and a second addressing circuit (20, 21) for addressing one of the reference cells (25a-25c, 26a-26c, 27, 28) during operations of read and verify of addressed memory cells (12).
Abstract:
A redundancy scheme for a memory integrated circuit having at least two memory sectors (S1-Sn) and, associated with each memory sector, a respective memory location selector (1031-103n) for selecting memory locations within the memory sector according to an address (ADD). The redundancy scheme comprises at least one redundant memory sector (RS1-RSm) adapted to functionally replace one of the at least two memory sectors, and a redundancy control circuitry (111) for causing the functional replacement of a memory sector declared to be unusable by one of the at least one redundant memory sector; the redundancy control circuitry detects an access request to a memory location within the unusable memory sector and diverts the access request to a corresponding redundant memory location in the redundant memory sector. Associated with each memory location selector, respective power supply control means (1131-113n) are provided adapted to selectively connect/disconnect the associated memory location selector to/from a power supply distribution line (VXR). A memory sector unusable status indicator element (211) is associated with each memory sector, for controlling the respective power supply control means so as to cause, when set, the selective disconnection of the respective memory location selector from the power supply distribution line.
Abstract:
Described herein is a nonvolatile memory (10) comprising an input pin (2) receiving an external clock signal (CK EST ) supplied by a user; an input buffer (4) receiving the external clock signal (CK EST ) and supplying an intermediate clock signal (CK INT1 ) delayed with respect to the external clock signal (CK EST ); and a delay locked loop (12) receiving the intermediate clock signal (CK INT1 ) and supplying an internal clock signal (CK INT ) distributed within the nonvolatile memory (10) and substantially in phase with the external clock signal (CK EST ).
Abstract:
An electrically erasable and programmable non-volatile memory device comprises at least one memory sector (S1-S8) comprising an array of memory cells (MC) arranged in rows (WL0-WL255) and first-level columns (BL0-BL255), the first-level columns (BL0-BL255) being grouped together in groups of first-level columns each coupled to a respective second-level column (B1-B64), first-level selection means (2) for selectively coupling one first-level column for each group to the respective second-level column, second-level selection means (3,4) for selecting one of the second-level columns, first direct memory access test means (SW6) activatable in a first test mode for directly coupling a selected memory cell (MC) of the array to a respective output terminal (Oi) of the memory device, redundancy columns (RBL0-RBL3) of redundancy memory cells (RMC) for replacing defective columns (BL0-BL255) of memory cells (MC), and a redundancy control circuit (CAM1-CAM4,5-7,12,SW1-SW5,24) comprising defective-address storage means (CAM1-CAM4) for storing addresses of the defective columns (BL0-BL255) and activating respective redundancy columns (RBL0-RBL3) when the defective columns are addressed. The redundancy control circuit comprises second direct memory access test means (24) activatable in a second test mode together with the first direct memory access test means for directly coupling memory elements (AB0-AB7,GB) of the defective-address storage means (CAM1-CAM4) to respective second-level columns (B1-B64) of the array, whereby the memory elements of the defective-address storage means can be directly coupled to output terminals (Oi) of the memory device.
Abstract:
Cumulative delay contributions introduced by an input buffer and by the metal line that distributes the buffered external control signal to a plurality of synchronizing and/or enabling circuits for performing a transfer of data to and from an integrated device, can be significantly reduced by having the external signal applied on a pad distributed unbuffered through a metal line of sufficiently large size (conductivity) such to introduce a negligible intrinsic propagation delay, though fulfilling the specified maximum admitted input pad capacitance, and by realizing locally dedicated input buffers to each of a plurality of synchronizing and/or enabling circuits of data transfer of the integrated device for applying thereto a buffered replica of the external signal present on said distributing metal line.