公开(公告)号：EP3896732A1

公开(公告)日：2021-10-20

申请号：EP21167688.7

申请日：2021-04-09

Applicant: STMicroelectronics S.r.l.

Inventor： STELLA, Cristiano Gianluca ,  COPPONE, Fabio Vito ,  SALAMONE, Francesco

IPC: H01L23/495 ,  H01L25/11 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433

Abstract: The power device for surface mounting has a leadframe (15) including a die-attach support (24C) and at least one first lead (4B) and one second lead (4C). A die (6), of semiconductor material, is bonded to the die-attach support, and a package (2), of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support (24C) and has a package height (H1). The first and second leads (4B, 4C) have outer portions (14B, 14C) extending outside the package (2), from two opposite lateral surfaces (2C, 2D) of the package. The outer portions of the leads have lead heights (H2) greater than the package height (H1), extend throughout the height of the package, and have respective portions projecting from the first base (2A).