Integrated device comprising a semiconductor material microactuator, in particular for a hard disc read/write head
    1.
    发明公开
    Integrated device comprising a semiconductor material microactuator, in particular for a hard disc read/write head 失效
    与半导体微驱动器的集成器件,尤其是对于读/写头,用于硬盘

    公开(公告)号:EP0975086A1

    公开(公告)日:2000-01-26

    申请号:EP98830447.3

    申请日:1998-07-22

    CPC classification number: G11B21/02 H02N1/006

    Abstract: The microactuator (1) comprises an outer stator (2'), and an inner rotor (4) electrostatically coupled to the stator (2'). The rotor (4) comprises a suspended mass (6) with a substantially circular shape, and a plurality of mobile arms (8) extending radially towards the exterior, starting from the suspended mass (6). The stator (2') has a plurality of pairs of fixed arms (22a', 22b', 22a'', 22b'') extending radially to the suspended mass (6), a respective mobile arm (8) being arranged between each pair of fixed arms. The fixed arms (20a', 20b', 20a'', 20b'') are divided into fixed drive arms (20a', 20b') connected to a drive stage (30) for actuating the microactuator (1'), and into fixed measure arms (20a'', 20b'') connected to a measure stage (32), and define a capacitive uncoupling structure (34').

    Abstract translation: 微致动器(1)外定子的包括(2“),并在帧内转子(4)静电耦合到所述定子(2”)。 转子(4)包括一个悬挂质量(6)具有基本上圆形的形状,并移动臂(8)径向延伸的朝向外部,从暂停(6)质量启动多个。 所述定子(2“)具有固定的臂的双(22a的多元性”,22B',22A“ 22B”“)径向延伸到所述悬挂质量(6),一个respectivement移动臂(8)的每个之间布置 一对固定臂。 被分成固定的驱动臂的固定臂连接到用于致动微致动器(1“)的驱动级(30)(20A '20B',20A '',20B '')(20A '20B'),并且进入 固定措施臂连接到一个测量阶段(32)(20A“”,20B“”),并定义电容解偶联结构(34“)。

    Method for compensating the position offset of a capacitive inertial sensor, andcapacitive inertial sensor
    3.
    发明公开
    Method for compensating the position offset of a capacitive inertial sensor, andcapacitive inertial sensor 审中-公开
    Verfahren zur Kompensation von Positionsfehlern eines kapazitiven inertialen传感器和卡帕扎特惯性传感器

    公开(公告)号:EP1083431A1

    公开(公告)日:2001-03-14

    申请号:EP99830568.4

    申请日:1999-09-10

    CPC classification number: G01C19/5712 G01P15/125 G01P15/131

    Abstract: The inertial sensor (1') comprises a stator (2) and a rotor (4) made of semiconductor material and electrostatically coupled together, and a microactuator (24) also made of semiconductor material, coupled to the rotor (4) and controlled so as to move the rotor (4) itself and thus compensate the position offset thereof.
    Rotor and stator are provided with interdigitated fingers and constitute capacitive elements. Manufacturing tolerances lead to a positional offset which results in a difference of the capacitances in the absence of acceleration. The actuator consists of interdigitated fingers which provide a force that rotates the rotor back to its nominal zero position. No interference exists between the capacitive elements of rotor and stator and the capacitive elements of the actuator.

    Abstract translation: 惯性传感器(1')包括定子(2)和由半导体材料制成并静电耦合在一起的转子(4)和还由半导体材料制成的微致动器(24),其耦合到转子(4)并被控制 以便使转子(4)本身移动,从而补偿其位置偏移。 转子和定子上带有叉指并构成电容元件。 制造公差导致在没有加速度的情况下导致电容差的位置偏移。 致动器由叉指组成,其提供使转子回转到其标称零位置的力。 转子和定子的电容元件与致动器的电容元件之间不存在干扰。

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