公开(公告)号：EP1707931A1

公开(公告)日：2006-10-04

申请号：EP05425183.0

申请日：2005-03-31

Applicant: STMicroelectronics S.r.l.

Inventor： Baldo, Lorenzo ,  Combi, Chantal ,  Sassolini, Simone ,  Del Sarto, Marco

IPC: G01L1/20

CPC classification number: G06F3/041 ,  G01L9/0045 ,  G01L9/0054 ,  G01L19/141 ,  G01L19/147 ,  G06F3/0338 ,  H01H13/785 ,  H01H2201/02 ,  H01H2201/036 ,  H01H2221/012 ,  H01H2239/01 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In a data-input device (4) an actuator element (6) that can be manually actuated, and a sensor (9) mechanically coupled to the actuator element (6). The sensor (9) is formed in a body (10) of semiconductor material housing a first sensitive element (11), which detects the actuation of the actuator element (6) and generates electrical control signals. The first sensitive element (11) is a microelectromechanical pressure sensor, formed by: a cavity (24) made within the body (10); a diaphragm (25) made in a surface portion of the body (10) and suspended above the cavity (24); and piezoresistive transducer elements (26) integrated in peripheral surface portions of the diaphragm (25) in order to detect its deformations upon actuation of the actuator element (6).

Abstract translation: 在数据输入装置（4）中，可以手动致动的致动器元件（6）和机械地联接到致动器元件（6）的传感器（9）。 传感器（9）形成在容纳有第一敏感元件（11）的半导体材料的本体（10）中，该第一敏感元件（11）检测致动元件（6）的致动并产生电控制信号。 第一敏感元件（11）是微机电压力传感器，其通过：在主体（10）内制成的空腔（24）形成。 在所述主体（10）的表面部分中形成并悬浮在所述空腔（24）上方的隔膜（25）; 以及压电换能器元件（26），其集成在隔膜（25）的外周表面部分中，以便在致动元件（6）致动时检测其变形。

公开(公告)号：EP1312580B1

公开(公告)日：2007-01-24

申请号：EP01830712.4

申请日：2001-11-16

Applicant: STMicroelectronics S.r.l.

Inventor： Sassolini, Simone ,  Del Sarto, Marco ,  Frezza, Giovanni ,  Baldo, Lorenzo

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00333

公开(公告)号：EP1443018A1

公开(公告)日：2004-08-04

申请号：EP03425015.9

申请日：2003-01-15

Applicant: STMicroelectronics S.r.l.

Inventor： Sassolini, Simone ,  Del Sarto, Marco ,  Baldo, Lorenzo

IPC: B81B5/00 ,  G11B5/55 ,  G01C19/56

CPC classification number: H02N1/008 ,  G01C19/5656 ,  G11B5/4826 ,  G11B5/5552 ,  G11B5/596

Abstract: A rotational micro-electro-mechanical structure includes a stator (21), having a plurality of stator electrodes (33, 34), and a rotor (23), which is rotatable with respect to the stator (21) about an axis of relative rotation (A) and has a plurality of rotor electrodes (30), the stator electrodes (33, 34) and the rotor electrodes (30) being comb-fingered; moreover, at least a first group (20a) of stator electrodes (33, 34) and rotor electrodes (30) are parallel to a first plane (P 1 ) that includes the axis of relative rotation (A).

Abstract translation: 旋转微电子机械结构包括具有多个定子电极（33,34）的定子（21）和可相对于定子（21）围绕相对轴线旋转的转子（23） 旋转（A）并且具有多个转子电极（30），定子电极（33,34）和转子电极（30）被梳齿指定; 此外，定子电极（33,34）和转子电极（30）的至少第一组（20a）平行于包括相对旋转轴线（A）的第一平面（P1）。

公开(公告)号：EP1359569A1

公开(公告)日：2003-11-05

申请号：EP02425276.9

申请日：2002-05-03

Applicant: STMicroelectronics S.r.l.

Inventor： Del Sarto, Marco ,  Marchi, Mauro ,  Baldo, Lorenzo ,  Sassolini, Simone

IPC: G11B5/48

CPC classification number: G11B5/4826

Abstract: A read/write assembly for magnetic hard disks includes at least: one supporting element (5, 8); one read/write (R/W) transducer (6); one micro-actuator (10), set between the R/W transducer (6) and the supporting element (5, 8); one electrical-connection structure (11) for connection to a remote device carried by the supporting element (5,8) and connected to the R/W transducer (6) and to the micro-actuator (10) In addition, a protective structure (15), set so as to cover the micro-actuator (10) is made of a single piece with the electrical-connection structure (11).

Abstract translation: 用于磁性硬盘的读/写组件至少包括：一个支撑元件（5,8）; 一个读/写（R / W）传感器（6）; 设置在R / W换能器（6）和支撑元件（5,8）之间的一个微致动器（10）; 一个电连接结构（11），用于连接到由支撑元件（5,8）承载并连接到R / W换能器（6）和微致动器（10）的远程设备。另外，保护结构 （15），以覆盖微致动器（10）的方式由具有电连接结构（11）的单件制成。

公开(公告)号：EP1312580A1

公开(公告)日：2003-05-21

申请号：EP01830712.4

申请日：2001-11-16

Applicant: STMicroelectronics S.r.l.

Inventor： Sassolini, Simone ,  Del Sarto, Marco ,  Frezza, Giovanni ,  Baldo, Lorenzo

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00333

Abstract: A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body (1) of semiconductor material, at least one microstructure (2) having at least one first portion (3) and one second portion (4) which are relatively mobile with respect to one another and are separated from one another by at least one gap region (14), which is accessible through a face (6) of the body (1); and sealing the gap (14). The sealing step includes depositing on the face (6) of the body (1) a layer (15) of protective material, in such a way as to close the gap region (14), the protective layer being such as to enable relative motion between the first portion (3) and the second portion (4) of the microstructure (2).

Abstract translation: 一种制造集成保护微结构的器件的方法，包括以下步骤：在半导体材料的本体（1）中形成至少一个具有至少一个第一部分（3）和一个第二部分（3）的微结构（2） 4），它们相对于彼此相对移动并且通过至少一个可通过主体（1）的面（6）接近的间隙区域（14）彼此分离; 并密封间隙（14）。 密封步骤包括在主体（1）的表面（6）上沉积保护材料层（15），以便封闭间隙区域（14），保护层能够进行相对运动 在微结构（2）的第一部分（3）和第二部分（4）之间。