公开(公告)号：EP1557881A1

公开(公告)日：2005-07-27

申请号：EP04100241.1

申请日：2004-01-23

Applicant: STMicroelectronics S.r.l.

Inventor： Deodato, Claudio ,  Casati, Paolo

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A lead-frame (400) for electronic devices (500) is proposed; the lead-frame is produced from a metal plate and includes a bearing structure (105) arranged in a first plane, and for each electronic device a support element (420) spaced apart from the first plane having a first surface (512) facing the bearing structure for mounting at least one chip (205) and an opposed second surface (515) for being exposed from the electronic device, the second surface being arranged in a second plane, and a plurality of interconnection elements (115) connecting the support element to the bearing structure. For each electronic device the lead-frame further includes an intermediate area (425) between the support element and the interconnection elements, the intermediate area being arranged in a third plane between the first and the second planes.

Abstract translation: 提出了一种用于电子设备（500）的引线框架（400） 引线框架由金属板制成并且包括布置在第一平面中的轴承结构（105），并且对于每个电子设备，与第一平面间隔开的支撑元件（420）具有与第一平面相对的第一表面（512） 用于安装至少一个芯片（205）和相对的第二表面（515）的轴承结构，用于从电子设备暴露，第二表面布置在第二平面中，以及多个互连元件（115），其将支撑元件 到轴承结构。 对于每个电子设备，引线框还包括在支撑元件和互连元件之间的中间区域（425），中间区域布置在第一和第二平面之间的第三平面中。

公开(公告)号：EP1473763A1

公开(公告)日：2004-11-03

申请号：EP03425281.7

申请日：2003-04-30

Applicant: STMicroelectronics S.r.l.

Inventor： Deodato, Claudio ,  Tiziani, Roberto

IPC: H01L21/48 ,  H01L23/495

CPC classification number: H01L21/4842 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing semiconductor electronic devices (1) comprising the step of:

forming, from a plane metallic foil defining a lie plane, a supporting frame (2) comprising a mount pad (3) for said devices and corresponding leads (4) being short-circuited to said mount pad (3),
characterised in that it comprises the steps of:

downsetting said mount pad (3) on a plane being parallel to said lie plane keeping at least a group of leads (4) on said lie plane and separating by shearing said mount plane (3) from said group of leads (4),
mounting a die on a first surface of said mount pad (3),
forming the electrical connections between said die and said group of leads (4),
encapsulating said frame (2) in a protective package (6) so as to leave the second surface of said mount pad (3), being opposite to said first surface, exposed from said protective package (6).

Abstract translation: 一种用于制造半导体电子器件（1）包括以下步骤的方法：形成，从平面金属箔限定谎言平面支撑框架（2）包括用于所述设备的安装垫（3）和相应的引线（4）是 短路到所述安装垫（3），它DASS包括以下步骤：向下设置所述安装垫（3）上平行于所述的平面平放保持至少一组在所述引线（4）的平放 并通过剪切所述安装平面分离（3）从所述引线的组（4），装入安装在所述已的第一表面垫（3），形成所述的爱和Said引线组之间的电连接（4） 封装所述框架（2）在保护性包（6），以便离开所述的第二表面安装垫（3）具有相反的所述第一表面，从所述保护外壳中暴露出来（6）。