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    A lead-frame for electronic devices with extruded pads
    1.
    发明公开
    A lead-frame for electronic devices with extruded pads 审中-公开
    保加利亚电子公司（Bauteil mit mitierten Kontakten）

    公开(公告)号：EP1557881A1

    公开(公告)日：2005-07-27

    申请号：EP04100241.1

    申请日：2004-01-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： Deodato, Claudio ,  Casati, Paolo

    IPC: H01L23/495

    CPC classification number: H01L23/49503 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05599

    Abstract: A lead-frame (400) for electronic devices (500) is proposed; the lead-frame is produced from a metal plate and includes a bearing structure (105) arranged in a first plane, and for each electronic device a support element (420) spaced apart from the first plane having a first surface (512) facing the bearing structure for mounting at least one chip (205) and an opposed second surface (515) for being exposed from the electronic device, the second surface being arranged in a second plane, and a plurality of interconnection elements (115) connecting the support element to the bearing structure. For each electronic device the lead-frame further includes an intermediate area (425) between the support element and the interconnection elements, the intermediate area being arranged in a third plane between the first and the second planes.

    Abstract translation: 提出了一种用于电子设备（500）的引线框架（400） 引线框架由金属板制成并且包括布置在第一平面中的轴承结构（105），并且对于每个电子设备，与第一平面间隔开的支撑元件（420）具有与第一平面相对的第一表面（512） 用于安装至少一个芯片（205）和相对的第二表面（515）的轴承结构，用于从电子设备暴露，第二表面布置在第二平面中，以及多个互连元件（115），其将支撑元件 到轴承结构。 对于每个电子设备，引线框还包括在支撑元件和互连元件之间的中间区域（425），中间区域布置在第一和第二平面之间的第三平面中。

    Insulated power multichip package
    3.
    发明公开
    Insulated power multichip package 有权
    Isolierte Leistungs-Multichippackung

    公开(公告)号：EP1139421A3

    公开(公告)日：2003-03-12

    申请号：EP00123110.9

    申请日：2000-10-25

    Applicant: STMicroelectronics S.r.l.

    Inventor： Casati, Paolo ,  Cognetti, Carlo

    IPC: H01L23/433 ,  H01L21/56

    CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

    Abstract: The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

    Abstract translation: 本发明包括具有彼此电隔离的至少两个芯片的多芯片集成电路封装。 在多芯片集成电路封装内是直接耦合到至少两个芯片的芯片，没有任何中间绝缘层。 芯片在两个芯片之间的适当位置物理分离，从而有效地消除了两个芯片之间的电气干扰。 使集成电路封装从将两个芯片直接连接到散热芯片开始。 散热块可以在芯片之间运行预切割槽。 一旦芯片连接到芯块上，芯块就被模制成多芯片集成电路封装。 然后，将塞子从下侧物理分离成两片，分离沿着预切割槽延伸。 通常，锯屑将被锯切割而分离。

    Insulated power multichip package
    5.
    发明公开
    Insulated power multichip package 有权
    Herstellungsverfahren einer isolierten Leistungs-Multichippackung

    公开(公告)号：EP1139421A2

    公开(公告)日：2001-10-04

    申请号：EP00123110.9

    申请日：2000-10-25

    Applicant: STMicroelectronics S.r.l.

    Inventor： Casati, Paolo ,  Cognetti, Carlo

    IPC: H01L23/433

    CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

    Abstract: The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

    Abstract translation: 本发明包括具有彼此电隔离的至少两个芯片的多芯片集成电路封装。 在多芯片集成电路封装内是直接耦合到至少两个芯片的芯片，没有任何中间绝缘层。 芯片在两个芯片之间的适当位置物理分离，从而有效地消除了两个芯片之间的电气干扰。 使集成电路封装从将两个芯片直接连接到散热芯片开始。 散热块可以在芯片之间运行预切割槽。 一旦芯片连接到芯块上，芯块就被模制成多芯片集成电路封装。 然后，将塞子从下侧物理分离成两片，分离沿着预切割槽延伸。 通常，锯屑将被锯切割而分离。

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