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1.发明授权Process for manufacturing a plastic package for electronic devices having an heat dissipator 失效Herstellunsgverfahren一个塑料封装的电子组件与散热器
公开(公告)号：EP0845801B1
公开(公告)日：2007-01-17
申请号：EP96830597.9
申请日：1996-11-27
Applicant: STMicroelectronics S.r.l.
Inventor： Ferri, Stefano , Rossi, Roberto , Poinelli, Renato
IPC: H01L21/56 , H01L23/433
CPC classification number: H01L23/4334 , H01L21/565 , H01L2924/0002 , H01L2924/00
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2.发明授权Method for manufacturing plastic package for electronic device having a fully insulated dissipator 失效一种生产塑料封装用于电子设备用完全绝缘散热片过程
公开(公告)号：EP0817261B1
公开(公告)日：2003-04-23
申请号：EP96830372.7
申请日：1996-06-28
Applicant: STMicroelectronics S.r.l.
Inventor： Ferri, Stefano , Rossi, Roberto
IPC: H01L23/28 , H01L21/56 , H01L23/433
CPC classification number: B29C45/14655 , H01L21/565 , H01L23/4334 , H01L2224/45144 , H01L2224/48247 , H01L2924/1815 , H01L2924/00
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