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    Offset edges mold for plastic packaging of integrated semiconductor devices
    2.
    发明公开
    Offset edges mold for plastic packaging of integrated semiconductor devices 审中-公开
    模具具有交错边缘集成半导体器件的塑料封装

    公开(公告)号：EP1075022A1

    公开(公告)日：2001-02-07

    申请号：EP99830508.0

    申请日：1999-08-04

    Applicant: STMicroelectronics S.r.l.

    Inventor： Poinelli, Renato ,  Mazzola, Mauro ,  Brioschi, Roberto

    IPC: H01L21/56

    CPC classification number: H01L21/565 ,  H01L2224/48247

    Abstract: A mold for plastic packaging of an integrated semiconductor device composed of two half shells closing on a perimetral dam-bar of a die-stamped assembly metal frame of the semiconductor dice disposed between the two half shells of the mold, the depressed central pad defining, at least along the zone of injection of the resin a slit between the perimetral portion of the frame and the central pad thereof through which the resin injected through an inlet channel flows to fill the upper part of the cavity of the mold, the edge of said central pad defining said flow slit being bent upward to form a spoiler intercepting the resin stream and directing part of the resin toward the relatively narrow space between the bottom of said depressed central pad of the frame and the lower half shell of said mold, has the inner edge of the upper half shell of the mold, that defines the internal cavity along the side of injection of the resin inwardly offset in respect to the opposite inner edge of the lower half shell of the mold. This offsetting cooperates with the spoiler in restricting the aperture of the flow slit.

    Abstract translation: 一种用于两个半壳闭合模具的两个半壳之间设置在半导体管芯的管芯标记的组件的金属框架的周界坝条上构成的集成半导体器件的塑料包装模具，凹陷中央垫限定， 至少沿所述树脂的注入区框架的周围部分以及它们的中央垫，通过该树脂通过在入口通道喷射之间的狭缝流动以填充模具的腔体的上部件，所述的边缘 中央垫限定所述流动狭缝被向上弯曲以形成扰流截取树脂流和引导所述树脂的一部分朝向所述的底部之间的相对较窄的空间压下框架的中心垫和所述模具的下半壳，具有 该模具的上半壳的内边缘，没有沿所述树脂的注入在相对于向内偏移到LO的相对内边缘的一侧定义内部空腔 谁帮助模具的外壳。 此偏移相配合，在限制流动狭缝的孔径的扰流板。

    Method for manufacturing semiconductor device packages
    4.
    发明公开
    Method for manufacturing semiconductor device packages 审中-公开
    HerstellungsverfahrenfürHalbleitergehäuseanordnungen

    公开(公告)号：EP1318544A1

    公开(公告)日：2003-06-11

    申请号：EP01830748.8

    申请日：2001-12-06

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mazzola, Mauro ,  Poinelli, Renato

    IPC: H01L23/433 ,  H01L21/56

    CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of molding a plastics package (20) for encapsulating a semiconductor integrated electronic device (10) supported on a conductive lead frame (50), which lead frame has a plurality of peripheral leads (60) integrally formed therewith and is coupled thermally to a heat sink element (30), said method comprising the step of:

    injecting a molten plastics material into a mold (90) containing said device (10); wherein said heat sink element (30) has at least one extension (70) extending in the direction toward a corner of the plastics package (20); and
    the molten plastics material is injected through a gate (11) provided on one side of said extension (70) to extend parallel thereto.

    Abstract translation: 一种模制塑料封装（20）的方法，所述塑料封装（20）用于封装支撑在导电引线框架（50）上的半导体集成电子器件（10），所述引线框架具有与其一体形成的多个外围引线（60），并且热耦合 一种散热元件（30），所述方法包括以下步骤：将熔融的塑料材料注入包含所述装置（10）的模具（90）中; 其中所述散热元件（30）具有至少一个延伸部（70），所述至少一个延伸部（70）朝向塑料封装（20）的角部延伸; 并且熔融塑料材料通过设置在所述延伸部（70）的一侧上的门（11）注入以与其平行延伸。

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