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1.发明授权Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink 失效电路板组件，其内部散热器被焊接到外部散热器包括在塑料壳体中的功率半导体元件的封装
公开(公告)号：EP0926733B1
公开(公告)日：2004-03-17
申请号：EP97830677.7
申请日：1997-12-16
Applicant: STMicroelectronics S.r.l.
Inventor： Tiziani, Roberto , Rossi, Roberto , Villa, Claudio Maria
IPC: H01L23/40 , H01L23/367
CPC classification number: H01L23/367 , H01L2924/0002 , H05K1/0203 , H05K3/341 , H05K2201/066 , H05K2201/10689 , H05K2201/10969 , Y02P70/613 , H01L2924/00
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2.发明公开Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink 失效电路板组件，其内部散热器被焊接到外部散热器包括在塑料壳体中的功率半导体元件的封装
公开(公告)号：EP0926733A1
公开(公告)日：1999-06-30
申请号：EP97830677.7
申请日：1997-12-16
Applicant: STMicroelectronics S.r.l.
Inventor： Tiziani, Roberto , Rossi, Roberto , Villa, Claudio Maria
IPC: H01L23/40 , H01L23/367
CPC classification number: H01L23/367 , H01L2924/0002 , H05K1/0203 , H05K3/341 , H05K2201/066 , H05K2201/10689 , H05K2201/10969 , Y02P70/613 , H01L2924/00
Abstract: An external heat sink (2) may be soldered to a metal slug (3) incorporated at the bottom of a molded body (4) of encapsulating resin of the package of an integrated power device for surface mounting on printed circuit board (7). The metal slug (3) has at least a portion protruding from an outer surface of at least one face of the body (4); an external metal heat sink (2), geometrically coupling with the packaged device over the printed circuit board (7), has at least a surface abutting with a surface of the resin body (4) thus defining a separation gap (10) between at least a surface of said protruding portion of the metal slug (3) and a surface (5, 9a, 9b) opposed to it of the external metal heat sink (2) that gets filled with molten solder alloy (8) during the normal soldering treatment to which the board is subjected.
Abstract translation: （4）封装的封装表面的集成功率器件的树脂安装在印刷电路板（7）（3）引入外部散热器（2）可以被焊接到金属块在模制体的底部。 金属块（3）具有至少从在所述主体（4）中的至少一个面的外表面突出的部分; 到外部金属散热片（2），几何上与所述封装装置耦合在印刷电路板（7），具有至少一个表面与在所述树脂体（4）因此限定（10）之间的分离间隙的表面抵接 至少一个突出反对的外部金属散热片（2）的金属块（3）和一表面（5，9A，9B）的部分的所述表面并得到正常的焊接过程中填充有熔融焊料合金（8） 其处理的板进行。
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3.发明授权Method for manufacturing plastic package for electronic device having a fully insulated dissipator 失效一种生产塑料封装用于电子设备用完全绝缘散热片过程
公开(公告)号：EP0817261B1
公开(公告)日：2003-04-23
申请号：EP96830372.7
申请日：1996-06-28
Applicant: STMicroelectronics S.r.l.
Inventor： Ferri, Stefano , Rossi, Roberto
IPC: H01L23/28 , H01L21/56 , H01L23/433
CPC classification number: B29C45/14655 , H01L21/565 , H01L23/4334 , H01L2224/45144 , H01L2224/48247 , H01L2924/1815 , H01L2924/00
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4.发明授权Process for manufacturing a plastic package for electronic devices having an heat dissipator 失效Herstellunsgverfahren一个塑料封装的电子组件与散热器
公开(公告)号：EP0845801B1
公开(公告)日：2007-01-17
申请号：EP96830597.9
申请日：1996-11-27
Applicant: STMicroelectronics S.r.l.
Inventor： Ferri, Stefano , Rossi, Roberto , Poinelli, Renato
IPC: H01L21/56 , H01L23/433
CPC classification number: H01L23/4334 , H01L21/565 , H01L2924/0002 , H01L2924/00
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