Abstract:
An electronic communications device, including: a body (32) of semiconductor material defining at least one integrated electronic circuit and having a top surface (32a); an electromagnetic shield (36); a radiant element (42); and a capacitive element (C) formed by a first electrode (50) and a second electrode (52), the radiant element (42) being arranged on top of the top surface (32a) and being ohmically connected to the first electrode (50) and the second electrode (52) by means of a first connection element (54) and a second connection element (56), respectively, the electromagnetic shield (36) being arranged between the radiant element (42) and the top surface (32a) and forming at least the second electrode.