Abstract:
An insulated gate field-effect transistor (100;300) is proposed, including a body region (115) of a first conductivity type formed in a semiconductor material layer (105) in correspondence of the front surface, a gate electrode (112) disposed over the body region with interposition of a gate dielectric (110), and a source region (120,145;320,145) and a drain region (125,150) of second conductivity type opposite to the first conductivity type, respectively formed in the body region and the semiconductor material layer. The source and drain region are provided spaced apart from each other by a channel zone (130) in a portion of the body region underlying the gate electrode, and a drift portion (135) of the semiconductor material layer between the channel zone and the drain region, the insulated gate extending over the drift portion. The drain region is located at a depth compared to a top surface of the semiconductor material layer to move charge carriers in the drift portion away from an interface between the semiconductor material layer and the gate dielectric.
Abstract:
A varactor (30) has a gate region (6), a first and a second biasing region (5a, 5b) of N + type, embedded in a well (4), and a first and a second extraction region (15a, 15b) of P + type, forming a pair of PN junctions (16a, 16b) with the well (4). The PN junctions (16a, 16b) are inversely biased and extract charge accumulating in the well (4), below the gate region (6), when the gate region (6) is biased to a lower voltage (V G ) than a predetermined threshold value.
Abstract:
High-Q, variable capacitance capacitor (20, 20'), comprising a pocket (22) of semiconductor material; a field insulating layer (23), covering the pocket; an opening (24) in the field insulating layer, delimiting a first active area (24); an access region (25) formed in the active area and extending at a distance from a first edge (24a) of the active area and adjacent to a second edge (24b) of the active area. A portion (26) of the pocket (22) is comprised between the access region (15) and the first edge (24a) and forms a first armature; an insulating region (30) extends above the portion (26) of said body, and a polysilicon region (31) extends above the insulating region (30) and forms a second armature. A portion of the polysilicon region extends above the field insulating layer (23), parallel to the access region (25); a plurality of contacts (32) are formed at a mutual distance along the portion of the polysilicon region (31) extending above the field insulating layer (23).