Abstract:
A removable storage device is described comprising at least one substrate (1) whereon a plurality of components (2, 3) are arranged. Advantageously, the removable storage device (10) comprises a casing (4) of the package type suitable to completely cover these components (2, 3) and to form, together with the substrate (1), an external coating of the removable storage device (10). Moreover, a method is described for assembling at least one removable storage device (10) thus realised.
Abstract:
In a storage system (20) for an electronic device (27), a system controller (21) is connected to an embedded storage device (23) for supervising writing and reading operations in the embedded storage device; a data manager (36) based upon a microprocessor (38) is integrated in the embedded storage device (23) and provides a high-level abstraction of the physical organization of the embedded storage device (23) through the definition of an own logic map. The data manager (36) is implemented outside the controller (21). The controller (21) is formed in a first semiconductor material region, the embedded storage device (23) is formed in a second semiconductor material region distinct from the first semiconductor material region, and the data manager (36) is formed in a third semiconductor material region distinct from the first semiconductor material region.
Abstract:
In a storage system (20) for an electronic device (27), a system controller (21) is connected to an embedded storage device (23) for supervising writing and reading operations in the embedded storage device; a data manager (36) based upon a microprocessor (38) is integrated in the embedded storage device (23) and provides a high-level abstraction of the physical organization of the embedded storage device (23) through the definition of an own logic map. The data manager (36) is implemented outside the controller (21). The controller (21) is formed in a first semiconductor material region, the embedded storage device (23) is formed in a second semiconductor material region distinct from the first semiconductor material region, and the data manager (36) is formed in a third semiconductor material region distinct from the first semiconductor material region.