Electronic device containing semiconductor polymers and corresponding manufacturing process
    1.
    发明公开
    Electronic device containing semiconductor polymers and corresponding manufacturing process 有权
    用半导体制造和相关聚合物的电子设备

    公开(公告)号:EP1814173A1

    公开(公告)日:2007-08-01

    申请号:EP06425040.0

    申请日:2006-01-30

    CPC classification number: H01L51/5203 Y10S428/917

    Abstract: Described herein is an electronic device (16) provided with an electrode (3, 4; 23, 34) and a region of polymeric material (15; 10) set in contact with the electrode. The electrode (3, 4; 23, 34) has a polysilicon region (3; 23) and a silicide region (4; 34), which coats the polysilicon region (3; 23) and is arranged, as interface, between the polysilicon region (3; 23) and the region of polymeric material (15; 10). The polysilicon region (3; 23) is doped with a doping level that is a function of a desired work function at the interface with the region of polymeric material (15; 10). The electronic device is, for example, a testing device for characterizing the properties of the polymeric material.

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