Determination of the thickness of a denuded zone in a silicon wafer
    1.
    发明公开
    Determination of the thickness of a denuded zone in a silicon wafer 失效
    在einer Siliziumscheibe的Bestimmung der Dicke der Blosszone

    公开(公告)号:EP0898298A1

    公开(公告)日:1999-02-24

    申请号:EP97830354.3

    申请日:1997-07-15

    CPC classification number: H01L22/12

    Abstract: The depth of a denuded layer in respect to a relatively defective bulk region of a monocrystalline semiconductor wafer is estimated in a nondestructive way by measuring effective diffusion length of injected excess minority charge carriers on a surface of the wafer having such a denuded layer and on a different portion of the surface of the wafer from where the denuded layer has been previously stripped-off by lapping and/or etching and by calculating the depth of the denuded layer through a best-fit procedure or through numerical processing of the measurement results on the basis of the diffusion equations of excess minority carriers.

    Abstract translation: 通过测量在具有这种剥离层的晶片的表面上注入的多余少数电荷载体的有效扩散长度,并以非破坏性方式估计裸晶层相对于单晶半导体晶片的相对有缺陷的体区的深度 已经通过研磨和/或蚀刻已经剥离了剥离层的晶片的表面的不同部分,并且通过最佳拟合程序或通过对测量结果进行数值处理来计算裸露层的深度 过剩少数载体扩散方程的基础。

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