公开(公告)号：EP2728976A1

公开(公告)日：2014-05-07

申请号：EP13190224.9

申请日：2013-10-25

Applicant: STMicroelectronics S.r.l. ,  Freescale Semiconductor, Inc.

Inventor： Rotigni, Mario ,  Moseley, Richard ,  Bhatt, Piyush ,  Edgington, Gregory C.

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H05K1/0262 ,  H05K1/0298 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09336 ,  H05K2201/09345

Abstract: It is described a printed circuit board (50). The board comprises a first outer layer (23), a second outer layer (20) and an integrated circuit (2) mounted on the second outer layer. The integrated circuit has a single exposed pad (1) electrically connected to a ground reference, it has a first supply pin (5) electrically connected to a first power supply (VCC1) and it has a second supply pin (105) electrically connected to a second power supply, wherein the first power supply is configured to generate a first supply current with frequency components higher than the frequency components of a second supply current generated by the second power supply. The board further comprises a first decoupling capacitor (3) mounted on the second outer layer in the proximity of the first supply pin (5), the first decoupling capacitor having a first terminal (8) electrically connected with the first supply pin (5) and having a second terminal (9), it comprises an inner layer (21) interposed between the first outer layer (23) and the second outer layer (20), the inner layer comprising a metal layer (4) electrically connected to said ground reference, it comprises a first Via (7-1) configured to electrically connect the exposed pad (1) with the metal layer (4) of the inner layer, it comprises a second Via (6) configured to electrically connect the second terminal (9) of the first decoupling capacitor with the metal layer (4) of the inner layer and it comprises a second decoupling capacitor (173) having a first pin (278) electrically connected to the second power supply and having a second pin (279) electrically connected to said ground reference.

Abstract translation: 描述了印刷电路板（50）。 板包括安装在第二外层上的第一外层（23），第二外层（20）和集成电路（2）。 集成电路具有电连接到接地基准的单个裸露焊盘（1），其具有电连接到第一电源（VCC1）的第一电源引脚（5），并且其具有电连接到 第二电源，其中所述第一电源被配置为产生具有高于由所述第二电源产生的第二电源电流的频率分量的频率分量的第一电源电流。 该板还包括安装在第二外层附近的第一电源引脚（5）的第一去耦电容器（3），第一去耦电容器具有与第一电源引脚（5）电连接的第一端子（8） 并且具有第二端子（9），其包括介于所述第一外层（23）和所述第二外层（20）之间的内层（21），所述内层包括电连接到所述地面的金属层（4） 参考，它包括被配置为将暴露的焊盘（1）与内层的金属层（4）电连接的第一通孔（7-1），其包括构造成电连接第二端子的第二通孔（6） 第一去耦电容器与内层的金属层（4）的第二去耦电容器（173），并且其包括第二去耦电容器（173），其具有电连接到第二电源并具有第二引脚（279）的第一引脚（278） 电连接到所述接地基准。