公开(公告)号：SE546842C2

公开(公告)日：2025-02-25

申请号：SE2051281

申请日：2020-11-04

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  FÄLDT SARA

IPC: C09J197/00 ,  C08L97/00 ,  C09D197/00

Abstract: The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

公开(公告)号：SE2051281A1

公开(公告)日：2022-05-05

申请号：SE2051281

申请日：2020-11-04

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  FÄLDT SARA

IPC: C09J197/00 ,  C08L97/00 ,  C09D197/00

Abstract: The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.