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    ADHESIVE FORMULATION COMPRISING LIGNIN
    1.
    发明申请
    ADHESIVE FORMULATION COMPRISING LIGNIN 审中-公开

    公开(公告)号：WO2019202478A9

    公开(公告)日：2019-10-24

    申请号：PCT/IB2019/053100

    申请日：2019-04-16

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR, Ben ,  ZAFAR, Ashar ,  EKSTRÖM, Jesper

    IPC: C09J197/00 ,  C08H8/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products.The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol- formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL).The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

    PROCESS FOR PREPARING A BONDING RESIN
    3.
    发明申请
    PROCESS FOR PREPARING A BONDING RESIN 审中-公开

    公开(公告)号：WO2020008311A1

    公开(公告)日：2020-01-09

    申请号：PCT/IB2019/055492

    申请日：2019-06-28

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR, Ben ,  TORSSELL, Staffan ,  HJELM, Lars ,  JANSSON, Li ,  PHAM, Huynh Tram Anh ,  ZAFAR, Ashar

    IPC: C09J197/02 ,  B27N3/00 ,  C08H7/00 ,  C08L97/02 ,  C09D197/00

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

    ADHESIVE FORMULATION COMPRISING LIGNIN
    4.
    发明申请
    ADHESIVE FORMULATION COMPRISING LIGNIN 审中-公开

    公开(公告)号：WO2019202478A1

    公开(公告)日：2019-10-24

    申请号：PCT/IB2019/053100

    申请日：2019-04-16

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR, Ben ,  ZAFAR, Ashar ,  EKSTRÖM, Jesper

    IPC: C09J197/00 ,  C08H8/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products.The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol- formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL).The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

    PROCESS FOR PREPARING A BONDING RESIN
    8.
    发明申请
    PROCESS FOR PREPARING A BONDING RESIN 审中-公开

    公开(公告)号：WO2019202477A1

    公开(公告)日：2019-10-24

    申请号：PCT/IB2019/053099

    申请日：2019-04-16

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR, Ben ,  ZAFAR, Ashar ,  EKSTRÖM, Jesper

    IPC: C09J197/00 ,  C08H8/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein a first resin prepared from lignin, formaldehyde and optionally phenol is mixed with a second resin prepared from lignin, formaldehyde and optionally phenol, wherein the first resin is different from the second resin, to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.

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