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    PROCESS FOR PREPARING A BONDING RESIN
    1.
    发明申请
    PROCESS FOR PREPARING A BONDING RESIN 审中-公开

    公开(公告)号：WO2020008311A1

    公开(公告)日：2020-01-09

    申请号：PCT/IB2019/055492

    申请日：2019-06-28

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR, Ben ,  TORSSELL, Staffan ,  HJELM, Lars ,  JANSSON, Li ,  PHAM, Huynh Tram Anh ,  ZAFAR, Ashar

    IPC: C09J197/02 ,  B27N3/00 ,  C08H7/00 ,  C08L97/02 ,  C09D197/00

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

    METHOD FOR PREPARING A BONDING RESIN
    2.
    发明申请
    METHOD FOR PREPARING A BONDING RESIN 审中-公开

    公开(公告)号：WO2022003614A1

    公开(公告)日：2022-01-06

    申请号：PCT/IB2021/055902

    申请日：2021-07-01

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR, Ashar ,  PHAM, Huynh Tram Anh

    IPC: C09J197/00 ,  C08K5/00 ,  C08K5/16 ,  C08L97/00

    Abstract: The present invention is directed to a method for preparing a bonding resin, wherein lignin in powder form or in the form of an aqueous dispersion is mixed with at an aqueous solution of least one substantially formaldehyde-free crosslinker that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the lignin, at a pH in the range of from 3 to 9, and optionally one or more additives.

    LIGNIN-BASED BONDING RESIN
    3.
    发明申请
    LIGNIN-BASED BONDING RESIN 审中-公开

    公开(公告)号：WO2022097014A1

    公开(公告)日：2022-05-12

    申请号：PCT/IB2021/060112

    申请日：2021-11-02

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR, Ashar ,  FÄLDT, Sara ,  PHAM, Huynh Tram Anh

    IPC: C09J197/00 ,  C08L97/00 ,  C09D197/00

    Abstract: The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

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