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    LIQUID LIGNIN COMPOSITION, LIGNIN-BASED RESIN, AND METHOD OF INCREASING THE SOLUBILITY OF LIGNIN
    3.
    发明申请
    LIQUID LIGNIN COMPOSITION, LIGNIN-BASED RESIN, AND METHOD OF INCREASING THE SOLUBILITY OF LIGNIN 审中-公开
    液体木质素组合物，木质素基树脂和提高木质素溶解性的方法

    公开(公告)号：WO2017163163A8

    公开(公告)日：2017-09-28

    申请号：PCT/IB2017/051592

    申请日：2017-03-20

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR, Ashar ,  ARESKOGH, Dimitri ,  EKSTRÖM, Jesper

    IPC: C09J197/00 ,  C07G1/00 ,  C08H7/00 ,  C08L97/00 ,  C09D197/02 ,  C09J161/00

    Abstract: The present invention relates to a liquid lignin mixture comprising 3-50 wt% methanol, 12-50 wt% ligninand5-85 wt% aqueous alkali solution wherein the concentration of said aqueous alkali solution is 1 to 50 wt% of alkali in water, based on the weight of said alkali solution prior to mixing with the other components of the mixture. The liquid lignin mixture can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.

    Abstract translation: 液体木质素混合物本发明涉及包含3-50重量％甲醇，12-50重量％木质素和5-85重量％碱性水溶液的液体木质素混合物，其中所述碱性水溶液的浓度为1至50 基于在与混合物的其他组分混合之前所述碱溶液的重量，水中碱的重量％。 液体木质素混合物可用于制造木质素基酚醛树脂，这在制造层压板时特别有用。

    METHOD FOR PREPARING A BONDING RESIN
    4.
    发明申请
    METHOD FOR PREPARING A BONDING RESIN 审中-公开

    公开(公告)号：WO2022003614A1

    公开(公告)日：2022-01-06

    申请号：PCT/IB2021/055902

    申请日：2021-07-01

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR, Ashar ,  PHAM, Huynh Tram Anh

    IPC: C09J197/00 ,  C08K5/00 ,  C08K5/16 ,  C08L97/00

    Abstract: The present invention is directed to a method for preparing a bonding resin, wherein lignin in powder form or in the form of an aqueous dispersion is mixed with at an aqueous solution of least one substantially formaldehyde-free crosslinker that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the lignin, at a pH in the range of from 3 to 9, and optionally one or more additives.

    PROCESS FOR PREPARING A BONDING RESIN
    5.
    发明申请
    PROCESS FOR PREPARING A BONDING RESIN 审中-公开

    公开(公告)号：WO2020261087A1

    公开(公告)日：2020-12-30

    申请号：PCT/IB2020/055857

    申请日：2020-06-22

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR, Ashar ,  EKSTRÖM, Jesper

    IPC: C09J197/00 ,  B27N3/00 ,  B32B21/00 ,  C08H7/00 ,  C09J163/00 ,  C08L63/00 ,  C08L97/00 ,  C09D163/00 ,  C09D197/00

    Abstract: The present invention relates to a process for preparing a bonding resin, lignin in solid form or in the form of a dispersion in water is mixed with a crosslinker; and optionally one or more additives followed by addition of a basic solution. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards, laminates or mineral wool insulation.

    BIOBASED ADHESIVE MIXTURE AND THE USE OF SAID ADHESIVE MIXTURE
    7.
    发明申请
    BIOBASED ADHESIVE MIXTURE AND THE USE OF SAID ADHESIVE MIXTURE 审中-公开

    公开(公告)号：WO2022200974A1

    公开(公告)日：2022-09-29

    申请号：PCT/IB2022/052525

    申请日：2022-03-21

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR, Ashar ,  ARESKOGH, Dimitri ,  JANSSON, Li

    IPC: C09J197/00 ,  C08L97/00 ,  C09J5/06 ,  C09J11/00

    Abstract: The present invention relates to adhesive mixtures. In particular, the invention concerns the use of lignin in biobased hot-melt (non-pressure sensitive) and pressure sensitive adhesives, as well as novel adhesive mixtures suitable for use as such adhesives. The adhesive mixture comprises 25-85 wt-% lignin, 10-75 wt-% plasticizer, 0-50 wt-% tackifier and 0-40 wt-% waxes, by solid weight. The combined amount of lignin, plasticizer, tackifier and waxes is at least 90 wt-%, by solid weight, of the adhesive mixture.

    PROCESS FOR PREPARING A BONDING RESIN
    8.
    发明申请
    PROCESS FOR PREPARING A BONDING RESIN 审中-公开

    公开(公告)号：WO2020008311A1

    公开(公告)日：2020-01-09

    申请号：PCT/IB2019/055492

    申请日：2019-06-28

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR, Ben ,  TORSSELL, Staffan ,  HJELM, Lars ,  JANSSON, Li ,  PHAM, Huynh Tram Anh ,  ZAFAR, Ashar

    IPC: C09J197/02 ,  B27N3/00 ,  C08H7/00 ,  C08L97/02 ,  C09D197/00

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.

    ADHESIVE FORMULATION COMPRISING LIGNIN
    9.
    发明申请
    ADHESIVE FORMULATION COMPRISING LIGNIN 审中-公开

    公开(公告)号：WO2019202478A1

    公开(公告)日：2019-10-24

    申请号：PCT/IB2019/053100

    申请日：2019-04-16

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR, Ben ,  ZAFAR, Ashar ,  EKSTRÖM, Jesper

    IPC: C09J197/00 ,  C08H8/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products.The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol- formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL).The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

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