中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.022 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE69632882D1

    公开(公告)日：2004-08-19

    申请号：DE69632882

    申请日：1996-02-27

    Applicant: SYMBOL TECHNOLOGIES INC

    Inventor： STERN MIKLOS ,  KATZ JOSEPH ,  CAMPANELLI JOSEPH ,  DVORKIS PAUL ,  METLITSKY BORIS ,  GUREVICH VLADIMIR ,  KRICHEVER MARK ,  MCGLYNN DANIEL R

    IPC: G06K7/10 ,  H01S5/183 ,  H01S5/42 ,  H01S5/10 ,  H01S5/40

    Abstract: An integrated optical module for an optical scanner has a lens (24) spaced from a vertical-cavity surface-emitting laser (VCSEL) (28) by a spacer (62). The module, in an alternative embodiment, may include a wafer frame (12), a suspended mirror (14) mounted for oscillation on the frame, a wafer substrate (108) bonded beneath the frame and a wafer cover (109) bonded above the frame. The cover includes a mirror travel stop (116) to protect the mirror against shock. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element (22,24) onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers (1100,1102,1104) are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules. The modules may provide either one-dimensional or two-dimensional scanning.

    6.
    发明专利
    未知

    公开(公告)号：DE69632882T2

    公开(公告)日：2005-07-14

    申请号：DE69632882

    申请日：1996-02-27

    Applicant: SYMBOL TECHNOLOGIES INC

    Inventor： STERN MIKLOS ,  KATZ JOSEPH ,  CAMPANELLI JOSEPH ,  DVORKIS PAUL ,  METLITSKY BORIS ,  GUREVICH VLADIMIR YURI ,  KRICHEVER MARK ,  MCGLYNN DANIEL R

    IPC: G06K7/10 ,  H01S5/183 ,  H01S5/42 ,  H01S5/10 ,  H01S5/40

    Abstract: An integrated optical module for an optical scanner has a lens (24) spaced from a vertical-cavity surface-emitting laser (VCSEL) (28) by a spacer (62). The module, in an alternative embodiment, may include a wafer frame (12), a suspended mirror (14) mounted for oscillation on the frame, a wafer substrate (108) bonded beneath the frame and a wafer cover (109) bonded above the frame. The cover includes a mirror travel stop (116) to protect the mirror against shock. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element (22,24) onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers (1100,1102,1104) are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules. The modules may provide either one-dimensional or two-dimensional scanning.

    Scan module for optical scanner
    7.
    发明公开
    Scan module for optical scanner 失效
    为光检拾的扫描模块

    公开(公告)号：EP0731417A3

    公开(公告)日：1998-10-21

    申请号：EP96301314

    申请日：1996-02-27

    Applicant: SYMBOL TECHNOLOGIES INC

    Inventor： STERN MIKLOS ,  KATZ JOSEPH ,  CAMPANELLI JOSEPH ,  DVORKIS PAUL ,  METLITSKY BORIS ,  GUREVICH VLADIMIR ,  KRICHEVER MARK ,  MCGLYNN DANIEL R

    IPC: G06K7/10 ,  H01S5/183 ,  H01S5/42

    CPC classification number: G06K7/10742 ,  G06K7/10574 ,  G06K7/10643 ,  G06K7/10722 ,  G06K7/10811 ,  H01S5/423

    Abstract: An integrated optical module for an optical scanner has a lens (24) spaced from a vertical-cavity surface-emitting laser (VCSEL) (28) by a spacer (62). The module, in an alternative embodiment, may include a wafer frame (12), a suspended mirror (14) mounted for oscillation on the frame, a wafer substrate (108) bonded beneath the frame and a wafer cover (109) bonded above the frame. The cover includes a mirror travel stop (116) to protect the mirror against shock. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element (22,24) onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers (1100,1102,1104) are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules. The modules may provide either one-dimensional or two-dimensional scanning.

Patent Agency Ranking