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公开(公告)号：WO2009102105A1
公开(公告)日：2009-08-20
申请号：PCT/KR2008/006185
申请日：2008-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： SONG, Seung-Hwan , KONG, Jun Jin , KIM, Jae Hong , LEE, Young Hwan , CHAE, Dong Hyuk , KIM, Tae Hun , CHO, Kyoung Lae
IPC: G11C16/00
CPC classification number: G11C16/3418 , G11C7/04 , G11C11/5621 , G11C16/3427 , G11C16/349 , G11C29/00
Abstract: A memory device and a memory device heat treatment method are provided. The memory device may include: a non-volatile memory device; one or more heating devices configured to contact with the non-volatile memory device and heat the non-volatile memory device; and a controller configured to control an operation of the one or more heating devices based on operational information of the non-volatile memory device. Through this, it may be possible to improve an available period of the non-volatile memory device.
Abstract translation: 提供了一种存储器件和存储器件热处理方法。 存储器件可以包括：非易失性存储器件; 配置成与所述非易失性存储器件接触并加热所述非易失性存储器件的一个或多个加热器件; 以及控制器，被配置为基于所述非易失性存储器件的操作信息来控制所述一个或多个加热装置的操作。 由此，可以改善非易失性存储器件的可用周期。
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公开(公告)号：WO2020197186A1
公开(公告)日：2020-10-01
申请号：PCT/KR2020/003880
申请日：2020-03-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： KIM, Tae Hun , CHOI, Jin Young
IPC: D06F58/20 , D06F58/30 , D06F103/50
Abstract: In accordance with one aspect of the disclosure, a clothes dryer includes: a refrigerant pressure sensor provided in at least one of a first pipe connecting an expander to an evaporator or a second pipe connecting the evaporator to a compressor; a refrigerant temperature sensor provided in the second pipe; an electronic expansion valve configured to control a refrigerant; and a controller configured to control the electronic expansion valve based on detection values of the refrigerant pressure sensor and the refrigerant temperature sensor.
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公开(公告)号：EP3203593B1
公开(公告)日：2018-09-26
申请号：EP16169917.8
申请日：2016-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： KIM, Tae Hyuck , ANN, Sung Jin , KIM, Tae Hun , CHOI, Jin Ho , SEO, Chang Geun , WOO, Won Myung , HA, Ka San , PARK, Sun Jin
CPC classification number: H01R13/6675 , H01R13/055 , H01R13/502 , H01R24/68 , H01R31/065 , H01R35/04
Abstract: An adapter having a rotatable plug is provided. The adapter includes a case having an installation hole which provides access to an interior of the case; a rotation member installed within the installation hole of the case, the rotation member being rotatable within the installation hole relative to the case; at least one connection pin installed in the rotation member and protruding from the case; and a guide member provided adjacent to installation hole in the interior of the case and configured to guide rotation of the rotation member.
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公开(公告)号：EP3306202A1
公开(公告)日：2018-04-11
申请号：EP16800229.3
申请日：2016-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： JANG, Hyeong Jin , KIM, Tae Hun , JEON, In Ki , CHOI, Kun Woo , HA, Yu Jeub
CPC classification number: H05B6/766 , F24C15/04 , H05B6/6414 , H05B6/6417 , H05B6/763
Abstract: Disclosed is a cooking appliance with an improved structure to increase visibility to get a better look at the inside of a cooking room during cooking while blocking electromagnetic waves generated in the cooking room from leaking out. The cooking appliance includes a main body configured to have having a cooking room and a door arranged on the front of the main body to open or and close the cooking room. The door includes a door frame configured to have an opening formed to see into the cooking room and a conductive border portion around the opening; a shielding member arranged to cover the opening and having a conductive blocking layer configured to block electromagnetic waves; and a fixing member arranged to combine the door frame and the shielding member.
Abstract translation: 本发明公开了一种具有改进结构的烹饪设备，以增加可见度，以在烹饪期间更好地观察烹饪室内部，同时阻止烹饪室中产生的电磁波泄漏。 烹饪器具包括主体，主体构造成具有烹饪室和布置在主体的前部以打开或关闭烹饪室的门。 所述门包括门框，所述门框被构造成具有形成为看到所述烹饪室中的开口以及围绕所述开口的导电边界部分; 屏蔽构件，所述屏蔽构件布置成覆盖所述开口并且具有被配置为阻挡电磁波的导电阻挡层; 以及固定构件，设置为组合门框和遮蔽构件。
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公开(公告)号：EP3190343A1
公开(公告)日：2017-07-12
申请号：EP15838831.4
申请日：2015-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： JUNG, Min Gyu , JANG, Hyeong Jin , CHOI, Kun Woo , KIM, Tae Hun , JEON, In Ki , JEONG, Sang Jin , HA, Yu Jeub , HAN, Dong Gi
CPC classification number: H05B6/6473 , F24C15/00 , F24C15/322 , F24C15/325 , H05B6/00 , H05B6/6447 , H05B6/80
Abstract: In accordance with one embodiment of the present disclosure, a cooking apparatus includes a casing, a cooking chamber formed inside the casing, a duct member formed outside the cooking chamber to extend from a first plate of the cooking chamber to a second plate forming an upper surface of the cooking chamber, a heater installed inside the duct member, and a fan installed inside the duct member and configured to blow air in the duct member, wherein the cooking chamber is formed to cook food using high-temperature air discharged into the cooking chamber through a first outlet part formed at the second plate.
Abstract translation: 根据本公开的一个实施例，烹饪设备包括壳体，形成在壳体内部的烹饪室，形成在烹饪室外部以从烹饪室的第一板延伸到第二板的管道构件，第二板形成上部 烹饪室的内表面;加热器，安装在管道构件内;以及风扇，安装在管道构件内并且构造成将空气吹到管道构件中，其中烹饪室形成为利用排放到烹饪中的高温空气烹饪食物 通过形成在第二板上的第一出口部分。
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Patent Agency Ranking
公开(公告)号：EP3647800A1
公开(公告)日：2020-05-06
申请号：EP19204360.2
申请日：2019-10-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： LEE, Hyuek Jae , KIM, Tae Hun , HWANG, Ji Hwan , KIM, Ji Hoon , HONG, Ji Seok
IPC: G01R31/28 , H01L25/065
Abstract: A semiconductor package (1a) includes a base (100) including a first bonding structure (ST1); and a first semiconductor chip (200), including a second bonding structure (ST2), the second bonding structure (ST2) being coupled to the first bonding structure (ST1) of the base (100), wherein the first bonding structure (ST1) includes: a test pad (TP); a first pad (P1a) being electrically connected to the test pad (TP); and a first insulating layer (INS1), wherein the second bonding structure (ST2) includes: a second pad (P2a) being electrically connected to the first pad (Pla); and a second insulating layer (INS2) being in contact with the first insulating layer (INS1), and wherein at least a portion of the test pad (TP) is in contact with the second insulating layer (INS2).
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公开(公告)号：EP3483935A1
公开(公告)日：2019-05-15
申请号：EP18190010.1
申请日：2018-08-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： LEE, Kyunghwan , KIM, Yongseok , KIM, Byoung-Taek , KIM, Tae Hun , SEO, Dongkyun , LIM, Junhee
IPC: H01L27/11524 , H01L27/11556 , H01L27/1157 , H01L27/11582
Abstract: A three-dimensional semiconductor memory device includes an electrode structure including gate electrodes and insulating layers, which are alternately stacked on a substrate, a semiconductor pattern extending in a first direction substantially perpendicular to a top surface of the substrate and penetrating the electrode structure, a tunnel insulating layer disposed between the semiconductor pattern and the electrode structure, a blocking insulating layer disposed between the tunnel insulating layer and the electrode structure, and a charge storing layer disposed between the blocking insulating layer and the tunnel insulating layer. The charge storing layer includes a plurality of first charge trap layers having a first energy band gap, and a second charge trap layer having a second energy band gap larger than the first energy band gap. The first charge trap layers are embedded in the second charge trap layer between the gate electrodes and the semiconductor pattern.
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公开(公告)号：EP3203593A1
公开(公告)日：2017-08-09
申请号：EP16169917.8
申请日：2016-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： KIM, Tae Hyuck , ANN, Sung Jin , KIM, Tae Hun , CHOI, Jin Ho , SEO, Chang Geun , WOO, Won Myung , HA, Ka San , PARK, Sun Jin
CPC classification number: H01R13/6675 , H01R13/055 , H01R13/502 , H01R24/68 , H01R31/065 , H01R35/04
Abstract: An adapter having a rotatable plug is provided. The adapter includes a case having an installation hole which provides access to an interior of the case; a rotation member installed within the installation hole of the case, the rotation member being rotatable within the installation hole relative to the case; at least one connection pin installed in the rotation member and protruding from the case; and a guide member provided adjacent to installation hole in the interior of the case and configured to guide rotation of the rotation member.
Abstract translation: 提供具有可旋转插头的适配器。 适配器包括具有安装孔的壳体，所述安装孔提供通向壳体内部的入口; 旋转构件，所述旋转构件安装在所述壳体的所述安装孔内，所述旋转构件能够相对于所述壳体在所述安装孔内旋转; 至少一个连接销，安装在所述旋转构件中并从所述壳体突出; 以及引导构件，其设置在壳体内部的安装孔附近，并构造成引导旋转构件的旋转。
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公开(公告)号：EP3190342A1
公开(公告)日：2017-07-12
申请号：EP15837491.8
申请日：2015-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： JEON, In Ki , KIM, Tae Hun , JANG, Hyeong Jin , JUNG, Min Gyu , JEONG, Sang Jin , JUNG, Yeo Wool , CHOI, Kun Woo , HA, Yu Jeub , HAN, Dong Gi
CPC classification number: F24C15/325 , H05B6/6473
Abstract: In accordance with an embodiment of the present disclosure, a cooking apparatus includes a casing, a cooking chamber provided inside the casing and including a discharge plate at which a plurality of outlet holes are formed, a tray provided at a bottom surface of the cooking chamber to support food, and a hot air discharging unit configured to discharge high-temperature air into the cooking chamber through the outlet holes, wherein the plurality of outlet holes are formed at a first area facing the tray.
Abstract translation: 根据本公开的实施例，烹饪设备包括壳体，设置在壳体内并包括排出板的烹饪室，在该排出板上形成有多个出口孔，设置在烹饪室的底表面处的托盘 以支撑食物;以及热空气排出单元，被配置为通过所述出口孔将高温空气排出到所述烹饪室中，其中，所述多个出口孔形成在面向所述盘的第一区域处。
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公开(公告)号：EP3648155A1
公开(公告)日：2020-05-06
申请号：EP19204283.6
申请日：2019-10-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： LEE, Hyuek Jae , KIM, Ji Hoon , KIM, Tae Hun , HONG, Ji Seok , HWANG, Ji Hwan
Abstract: A semiconductor package (1a) is provided. The semiconductor package (1a) includes a lower structure (100) including an upper insulating layer (190) and an upper pad (195); and a semiconductor chip (200) provided on the lower structure (100) and comprising a lower insulating layer (250) and a lower pad (255). The lower insulating layer (190) is in contact with and coupled to the upper insulating layer (250) and the lower pad (195) is in contact with and coupled to the upper pad (255), and a lateral side (201s) of the semiconductor chip (200) extends between an upper side (201b) and a lower side (201f) of the semiconductor chip (200) and comprises a recessed portion (201s2).
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