公开(公告)号：US20110012251A1

公开(公告)日：2011-01-20

申请号：US12833728

申请日：2010-07-09

Applicant: Satoshi TERAMAE

Inventor： Satoshi TERAMAE

IPC: H01L23/04 ,  H01L21/56

CPC classification number: H01L23/24 ,  H01L23/562 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to one embodiment, a semiconductor device includes a base substrate, at least one semiconductor chip provided above the base substrate, and a resin case covering the semiconductor chip and supported by the base substrate. A partition plate holds back extension of a crack occurring in the resin case being provided in the resin case.

Abstract translation: 根据一个实施例，半导体器件包括基底基板，设置在基底基板上方的至少一个半导体芯片以及覆盖半导体芯片并被基底基板支撑的树脂壳体。 分隔板阻止在设置在树脂壳体中的树脂壳体中发生的裂缝的延伸。

公开(公告)号：US20110284924A1

公开(公告)日：2011-11-24

申请号：US13052025

申请日：2011-03-18

Applicant: Satoshi TERAMAE

Inventor： Satoshi TERAMAE

IPC: H01L29/739 ,  H01L27/12

CPC classification number: H01L25/072 ,  H01L23/04 ,  H01L23/049 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L2224/29101 ,  H01L2224/32013 ,  H01L2224/32238 ,  H01L2224/45124 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/222 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/1028 ,  H05K2201/10287 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device includes: an insulating substrate; a first electrode pattern and a second electrode pattern provided apart from each other on a major surface of the insulating substrate; a semiconductor element connected to the first electrode pattern; an electrode terminal connected to the second electrode pattern; and a connection wiring. The connection wiring electrically connects the first electrode pattern and the second electrode pattern with each other and has a thermal resistance larger than that of the first electrode pattern.

Abstract translation: 半导体器件包括：绝缘基板; 在所述绝缘基板的主表面上彼此分开设置的第一电极图案和第二电极图案; 连接到第一电极图案的半导体元件; 连接到第二电极图案的电极端子; 和连接线。 连接布线将第一电极图案和第二电极图案彼此电连接并且具有比第一电极图案的热阻大的热阻。