公开(公告)号：US20230045615A1

公开(公告)日：2023-02-09

申请号：US17787424

申请日：2020-03-31

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Yong CHEN ,  Yongjing XU ,  Guofang TANG

IPC: C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K3/32 ,  C08K5/5313 ,  C08K5/5377 ,  C08K5/5419 ,  C08J5/24 ,  B32B7/12 ,  B32B15/20 ,  B32B15/14

Abstract: Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

公开(公告)号：US20150247015A1

公开(公告)日：2015-09-03

申请号：US14617071

申请日：2015-02-09

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yong CHEN

IPC: C08J5/24 ,  C08L63/00 ,  C08L63/04 ,  C08L63/08

CPC classification number: C08J5/24 ,  C08G59/42 ,  C08G59/4261 ,  C08J2363/00 ,  C08J2363/04 ,  C08J2363/10 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L25/04 ,  C08L25/18

Abstract: The present invention discloses a thermosetting resin composition, which comprises epoxy resin with 2 or more than 2 epoxy groups in each resin molecule; and active ester containing styrene structure. The thermosetting resin composition is used to prepare resin sheet, resin composite metal copper foil, prepreg, laminate, copper clad laminate, printed circuit board and the like. The thermosetting resin composition significantly reduces the probability of delamination in PCB substrate, and the obtained resin composition has excellent thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and excellent flame retardancy.

Abstract translation: 本发明公开了一种热固性树脂组合物，其包含在每个树脂分子中具有2个或多于2个环氧基的环氧树脂; 和含有苯乙烯结构的活性酯。 热固性树脂组合物用于制备树脂片，树脂复合金属铜箔，预浸料，叠层，覆铜层压板，印刷电路板等。 热固性树脂组合物显着地降低了PCB基板中的分层的可能性，所得到的树脂组合物具有优异的热稳定性和耐湿热性，低介电常数和介电损耗角切线，以及优异的阻燃性。