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1.发明公开Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment 审中-公开一种半导体器件，半导体封装，电子装置和方法，用于实现一个信息处理环境
公开(公告)号：EP1301062A3
公开(公告)日：2006-08-09
申请号：EP02021878.0
申请日：2002-09-30
Applicant: Sony Computer Entertainment Inc.
CPC classification number: H01L25/165 , H01L23/525 , H01L25/105 , H01L25/18 , H01L2225/1005 , H01L2924/0002 , H05K1/181 , H05K2201/09409 , H05K2201/09418 , H05K2201/09709 , H05K2201/10159 , H05K2201/10689 , Y02P70/611 , H01L2924/00
Abstract: To provide an electronic device on which semiconductor packages can be mounted efficiently. The electronic device comprises a board (1) that can receive a plurality of first semiconductor packages (P0-P8) each carrying a processor device and a plurality of second semiconductor packages (M0-M8) each carrying a memory device. Mount regions (3) where the packages are to be mounted and non-mount regions (4) are alternately arranged in rows and columns on the board (1). This ensures approximately equal wiring distances between the packages, allowing processor devices to access to memory devices at the same timing.
Abstract translation: 以提供在其上的半导体封装可被有效地安装电子装置。 该电子设备包括一个板（1）那样可以接收第一半导体封装（P0-P8）每个都带有处理器装置和第二半导体封装有多个（M0-M8）各自携带的存储器装置的复数。 将被安装安装区域（3），其中包和非安装区域（4）以行和列被交替地布置在板（1）。 这确保了包装之间大约等于布线距离，允许处理器设备在相同的定时存取存储器装置。
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2.发明公开Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment 审中-公开一种半导体器件，半导体封装，电子装置和方法，用于实现一个信息处理环境
公开(公告)号：EP1301062A2
公开(公告)日：2003-04-09
申请号：EP02021878.0
申请日：2002-09-30
Applicant: Sony Computer Entertainment Inc.
CPC classification number: H01L25/165 , H01L23/525 , H01L25/105 , H01L25/18 , H01L2225/1005 , H01L2924/0002 , H05K1/181 , H05K2201/09409 , H05K2201/09418 , H05K2201/09709 , H05K2201/10159 , H05K2201/10689 , Y02P70/611 , H01L2924/00
Abstract: To provide an electronic device on which semiconductor packages can be mounted efficiently. The electronic device comprises a board (1) that can receive a plurality of first semiconductor packages (P0-P8) each carrying a processor device and a plurality of second semiconductor packages (M0-M8) each carrying a memory device. Mount regions (3) where the packages are to be mounted and non-mount regions (4) are alternately arranged in rows and columns on the board (1). This ensures approximately equal wiring distances between the packages, allowing processor devices to access to memory devices at the same timing.
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公开(公告)号：EP1300805A2
公开(公告)日：2003-04-09
申请号：EP02022203.0
申请日：2002-10-01
Applicant: Sony Computer Entertainment Inc.
IPC: G06T15/70
Abstract: At a site on a moving object image, one or more units, i.e., image components combinable with or separable from the image, are placed. The motion of each unit is determined by a geometry processor (10) along with the motion of object images. The geometry processor (10) sequentially writes, in a unit management table (30), coordinates of central points and vertices of each unit, the velocity of the central points, textures and color. A unit controller reads the location and velocity of each unit from the unit management table (30), calculates the distance and relative velocity between the units, and compares or separates the units with or from each other according to the distance and relative velocity. The unit controller then writes the coordinates of the units in the unit management table (30). A rendering processor draws an object image including the units according to the information written in the unit management table (30).
Abstract translation: 在移动物体图像上的位置处，放置一个或多个单元，即与图像组合或可与图像分离的图像分量。 每个单元的运动由几何处理器（10）以及物体图像的运动决定。 几何处理器（10）在单元管理表（30）中顺序地写入每个单元的中心点和顶点的坐标，中心点的速度，纹理和颜色。 单元控制器从单元管理表（30）读取每个单元的位置和速度，计算单元之间的距离和相对速度，并根据距离和相对速度比较或分离单元。 单元控制器然后将单元的坐标写入单元管理表（30）。 渲染处理器根据写在单元管理表（30）中的信息绘制包括单元的对象图像。
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