公开(公告)号：WO1994023451A1

公开(公告)日：1994-10-13

申请号：PCT/US1994003346

申请日：1994-03-28

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  GRUBE, Gary ,  KHANDROS, Igor ,  MATHIEU, Gaetan

IPC: H01L23/42

CPC classification number: H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49004 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a chip (20), terminals (34) permanently electrically connected to the chip by flexible leads (36) and a resilient element (48) or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate (52) having contact pads (58) so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer (28) and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Engagement of this assembly with the substrate does not involve soldering or other complex bonding processes. The assembly may occupy an area only slightly larger than the area of the chip itself.

Abstract translation: 半导体芯片组件包括芯片（20），通过柔性引线（36）和弹性元件（48）永久地电连接到芯片的端子（34）或用于将端子偏压离开芯片的元件。 芯片与具有接触焊盘（58）的基板（52）永久地接合，使得端子设置在芯片和基板之间，并且端子在由弹性元件施加的力的影响下接合接触焊盘。 端子通常设置在柔性片状电介质插入件（28）上，并且弹性元件设置在插入件和芯片之间。 可以在与基板接合之前测试芯片和端子的组件。 该组件与衬底的接合不涉及焊接或其它复杂的结合工艺。 组件可以占据仅稍大于芯片本身的面积的区域。