公开(公告)号：WO2009023283A2

公开(公告)日：2009-02-19

申请号：PCT/US2008009840

申请日：2008-08-15

Applicant: TESSERA INC ,  KWON JINSU ,  ENDO KIMITAKA ,  MORAN SEAN

Inventor： KWON JINSU ,  ENDO KIMITAKA ,  MORAN SEAN

IPC: H01L23/48

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An interconnection element (170, 190) is provided for conductive interconnection with another element (172) having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element (187) having a major surface. A plated metal layer (130, 192) including a plurality of exposed metal posts (130) can project outwardly beyond the major surface (176) of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element (187). The interconnection element typically includes a plurality of terminals (151) in conductive communication with the metal posts. The terminals can be connected through the dielectric element (187) to the metal posts (130). The posts may be defined by plating a metal (122, 124) onto exposed co-planar surfaces of a mandrel (120) and interior surfaces of openings (102) in a mandrel, after which the mandrel can be removed.

Abstract translation: 提供互连元件（170,190）用于与具有至少一个微电子器件或其上的布线的另一元件（172）导电互连。 互连元件包括具有主表面的电介质元件（187）。 包括多个暴露的金属柱（130）的镀金属层（130,192）可以向外突出超过介电元件的主表面（176）。 一些金属柱可以通过介电元件（187）彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子（151）。 端子可以通过介电元件（187）连接到金属柱（130）。 可以通过将金属（122,124）镀到心轴（120）的暴露的共面表面和心轴中的开口（102）的内表面上来限定所述柱，之后可以移除心轴。

公开(公告)号：EP2206145A4

公开(公告)日：2012-03-28

申请号：EP08835829

申请日：2008-09-26

Applicant: TESSERA INC

Inventor： KWON JINSU

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/14 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3178 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1147 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1412 ,  H01L2224/16 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81894 ,  H01L2224/831 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/2064 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

公开(公告)号：EP2186132A4

公开(公告)日：2018-01-03

申请号：EP08795418

申请日：2008-08-15

Applicant: TESSERA INC

Inventor： KWON JINSU ,  ENDO KIMITAKA ,  MORAN SEAN

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

公开(公告)号：WO2009045371A3

公开(公告)日：2009-05-22

申请号：PCT/US2008011271

申请日：2008-09-26

Applicant: TESSERA INC ,  KWON JINSU

Inventor： KWON JINSU

IPC: H01L21/60

CPC classification number: H01L24/14 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3178 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1147 ,  H01L2224/13015 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1412 ,  H01L2224/16 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81894 ,  H01L2224/831 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/2064 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A packaged microelectronic assembly includes a microelectronic element (104) having a front surface (122) and a plurality of first solid metal posts (110) extending away from the front surface (122). Each of the first posts (110) has a width in a direction of the front surface (122) and a height extending from the front surface (122), wherein the height (H2) is at least half of the width (Wl). There is also a substrate (102) having a top surface (101) and a plurality of second solid metal posts (108) extending from the top surface (102) and joined to the first solid metal posts (110).

Abstract translation: 封装的微电子组件包括具有前表面（122）和远离前表面（122）延伸的多个第一固体金属柱（110）的微电子元件（104）。 每个第一柱（110）具有在前表面（122）的方向上的宽度和从前表面（122）延伸的高度，其中高度（H2）至少是宽度（W1）的一半。 还有一个具有顶面（101）和多个从顶面（102）延伸并连接到第一固体金属柱（110）的第二固体金属柱（108）的衬底（102）。

公开(公告)号：WO2009023284A3

公开(公告)日：2009-04-16

申请号：PCT/US2008009841

申请日：2008-08-15

Applicant: TESSERA INC ,  MORAN SEAN ,  KWON JINSU ,  ENDO KIMITAKA

Inventor： MORAN SEAN ,  KWON JINSU ,  ENDO KIMITAKA

IPC: H01L23/48 ,  G05F1/00

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An interconnection element (170) can be formed by- plating a metal layer (124) within holes (106) in an essentially non-metallic layer (104) of a mandrel 120), wherein posts (130) can be plated onto a metal layer (102) exposed within the holes, e.g., a metal layer covering the holes in the non-metallic layer. The tips (160) of the posts can be formed adjacent to ends or bottoms of the blind holes. Terminals (151) can be formed in conductive communication with the conductive posts. The terminals can be connected through a dielectric layer (187) to the conductive posts. At least a portion of the mandrel (120) can then be removed from at least ends of the holes. In this way, the tips (160) of the conductive posts can become raised above a major surface (152), (176) of the interconnection element such that at least the tips of the posts project beyond the major surface.

Abstract translation: 互连元件（170）可以通过在心轴120的基本非金属层（104）中的孔（106）内镀覆金属层（124）而形成，其中柱（130）可镀在金属 露出在孔内的层（102），例如覆盖非金属层中的孔的金属层。 柱的尖端（160）可以邻近盲孔的端部或底部形成。 端子（151）可以形成为与导电柱导电连通。 端子可以通过电介质层（187）连接到导电柱。 然后可以从孔的至少端部移除心轴（120）的至少一部分。 以这种方式，导电柱的尖端（160）可以在互连元件的主表面（152），（176）上方升高，使得至少柱的尖端突出超过主表面。