公开(公告)号：WO2009023284A3

公开(公告)日：2009-04-16

申请号：PCT/US2008009841

申请日：2008-08-15

Applicant: TESSERA INC ,  MORAN SEAN ,  KWON JINSU ,  ENDO KIMITAKA

Inventor： MORAN SEAN ,  KWON JINSU ,  ENDO KIMITAKA

IPC: H01L23/48 ,  G05F1/00

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An interconnection element (170) can be formed by- plating a metal layer (124) within holes (106) in an essentially non-metallic layer (104) of a mandrel 120), wherein posts (130) can be plated onto a metal layer (102) exposed within the holes, e.g., a metal layer covering the holes in the non-metallic layer. The tips (160) of the posts can be formed adjacent to ends or bottoms of the blind holes. Terminals (151) can be formed in conductive communication with the conductive posts. The terminals can be connected through a dielectric layer (187) to the conductive posts. At least a portion of the mandrel (120) can then be removed from at least ends of the holes. In this way, the tips (160) of the conductive posts can become raised above a major surface (152), (176) of the interconnection element such that at least the tips of the posts project beyond the major surface.

Abstract translation: 互连元件（170）可以通过在心轴120的基本非金属层（104）中的孔（106）内镀覆金属层（124）而形成，其中柱（130）可镀在金属 露出在孔内的层（102），例如覆盖非金属层中的孔的金属层。 柱的尖端（160）可以邻近盲孔的端部或底部形成。 端子（151）可以形成为与导电柱导电连通。 端子可以通过电介质层（187）连接到导电柱。 然后可以从孔的至少端部移除心轴（120）的至少一部分。 以这种方式，导电柱的尖端（160）可以在互连元件的主表面（152），（176）上方升高，使得至少柱的尖端突出超过主表面。

公开(公告)号：WO2009048604A3

公开(公告)日：2009-09-24

申请号：PCT/US2008011632

申请日：2008-10-08

Applicant: TESSERA INC ,  HABA BELGACEM ,  OGANESIAN VAGE ,  ENDO KIMITAKA

Inventor： HABA BELGACEM ,  OGANESIAN VAGE ,  ENDO KIMITAKA

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/24226 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An interconnect element (130) can include a dielectric layer (116) having a top face (116b) and a bottom face (116a) remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces (132, 134). A plurality of conductive protrusions (112) can extend upwardly from the plane defined by the first metal layer (102) through the dielectric layer (116). The conductive protrusions (112) can have top surfaces (126) at a first height (115) above the first metal layer (132) which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias (128) can extend from the top surfaces (126) of the protrusions (112) to connect the protrusions (112) with the second metal layer.

Abstract translation: 互连元件（130）可以包括具有远离顶面的顶面（116b）和底面（116a）的介电层（116），限定沿着底面延伸的平面的第一金属层以及第二金属 层沿着顶面延伸。 第一或第二金属层之一或两者可以包括多个导电迹线（132,134）。 多个导电突起（112）可以从由第一金属层（102）限定的平面穿过介电层（116）向上延伸。 导电凸起（112）可以具有在第一金属层（132）上方的第一高度（115）处的顶表面（126），其可以大于电介质层的高度的50％。 多个导电通孔（128）可以从突起（112）的顶表面（126）延伸以将突起（112）与第二金属层连接。

公开(公告)号：WO2010005592A8

公开(公告)日：2011-02-10

申请号：PCT/US2009004033

申请日：2009-07-08

Applicant: TESSERA INC ,  RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

Inventor： RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L21/48

CPC classification number: B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A microelectronic interconnect element can include a plurality of first metal lines (110) and plurality of second metal lines (110') interleaved with the first metal lines (110). Each of the first and second metal lines has a surface (122), (120') extending within the same reference plane. The first metal lines (110) have surfaces (120) above the reference plane and remote therefrom and the second metal lines (110') have surfaces (122') below the reference plane and remote therefrom. A dielectric layer (114A) can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract translation: 微电子互连元件可以包括与第一金属线（110）交错的多个第一金属线（110）和多个第二金属线（110'）。 第一和第二金属线中的每一个具有在同一参考平面内延伸的表面（122），（120'）。 第一金属线（110）在参考平面上方具有远离其的表面（120），并且第二金属线（110'）在参考平面下方具有远离其的表面（122'）。 电介质层（114A）可以将第一金属线的金属线与第二金属线的相邻金属线分开。

公开(公告)号：WO2010005592A2

公开(公告)日：2010-01-14

申请号：PCT/US2009004033

申请日：2009-07-08

Applicant: TESSERA INC ,  RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

Inventor： RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

IPC: H01L23/498

CPC classification number: B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A microelectronic interconnect element can include a plurality of first metal lines (110) and plurality of second metal lines (110') interleaved with the first metal lines (110). Each of the first and second metal lines has a surface (122), (120') extending within the same reference plane. The first metal lines (110) have surfaces (120) above the reference plane and remote therefrom and the second metal lines (110') have surfaces (122') below the reference plane and remote therefrom. A dielectric layer (114A) can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract translation: 微电子互连元件可以包括与第一金属线（110）交错的多个第一金属线（110）和多个第二金属线（110'）。 第一和第二金属线中的每一个具有在同一参考平面内延伸的表面（122），（120'）。 第一金属线（110）具有位于参考平面之上并远离其的表面（120），并且第二金属线（110'）具有在参考平面之下并远离其的表面（122'）。 介电层（114A）可将第一金属线的金属线与第二金属线的相邻金属线分隔开。

公开(公告)号：WO2009023283A2

公开(公告)日：2009-02-19

申请号：PCT/US2008009840

申请日：2008-08-15

Applicant: TESSERA INC ,  KWON JINSU ,  ENDO KIMITAKA ,  MORAN SEAN

Inventor： KWON JINSU ,  ENDO KIMITAKA ,  MORAN SEAN

IPC: H01L23/48

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An interconnection element (170, 190) is provided for conductive interconnection with another element (172) having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element (187) having a major surface. A plated metal layer (130, 192) including a plurality of exposed metal posts (130) can project outwardly beyond the major surface (176) of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element (187). The interconnection element typically includes a plurality of terminals (151) in conductive communication with the metal posts. The terminals can be connected through the dielectric element (187) to the metal posts (130). The posts may be defined by plating a metal (122, 124) onto exposed co-planar surfaces of a mandrel (120) and interior surfaces of openings (102) in a mandrel, after which the mandrel can be removed.

Abstract translation: 提供互连元件（170,190）用于与具有至少一个微电子器件或其上的布线的另一元件（172）导电互连。 互连元件包括具有主表面的电介质元件（187）。 包括多个暴露的金属柱（130）的镀金属层（130,192）可以向外突出超过介电元件的主表面（176）。 一些金属柱可以通过介电元件（187）彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子（151）。 端子可以通过介电元件（187）连接到金属柱（130）。 可以通过将金属（122,124）镀到心轴（120）的暴露的共面表面和心轴中的开口（102）的内表面上来限定所述柱，之后可以移除心轴。

公开(公告)号：EP2186132A4

公开(公告)日：2018-01-03

申请号：EP08795418

申请日：2008-08-15

Applicant: TESSERA INC

Inventor： KWON JINSU ,  ENDO KIMITAKA ,  MORAN SEAN

IPC: H01L23/48 ,  H01L21/48

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

Abstract: An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

公开(公告)号：EP2213148A4

公开(公告)日：2011-09-07

申请号：EP08837045

申请日：2008-10-08

Applicant: TESSERA INC

Inventor： HABA BELGACEM ,  OGANESIAN VAGE ,  ENDO KIMITAKA

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/24226 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1189 ,  H01L2924/00

Abstract: An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer defining a plane extending along the bottom face and a second metal layer extending along the top face. One of the first or second metal layers, or both, can include a plurality of conductive traces 132, 134. A plurality of conductive protrusions 112 can extend upwardly from the plane defined by the first metal layer 102 through the dielectric layer 116. The conductive protrusions 112 can have top surfaces 126 at a first height 115 above the first metal layer 132 which may be more than 50% of a height of the dielectric layer. A plurality of conductive vias 128 can extend from the top surfaces 126 of the protrusions 112 to connect the protrusions 112 with the second metal layer.

Abstract translation: 互连元件130可以包括具有顶面116b和远离顶面的底面116a的电介质层116，限定沿着底面延伸的平面的第一金属层和沿着顶面延伸的第二金属层。 第一或第二金属层之一或两者可以包括多个导电迹线132,134。多个导电突起112可以从由第一金属层102限定的平面向上延伸穿过电介质层116.导电 突起112可以具有在第一金属层132上方的第一高度115处的顶表面126，其可以大于电介质层的高度的50％。 多个导电通孔128可以从突起112的顶表面126延伸，以将突起112与第二金属层连接。