公开(公告)号：JP2006032938A

公开(公告)日：2006-02-02

申请号：JP2005181280

申请日：2005-06-21

Applicant: Tessera Inc ,  テセラ,インコーポレイテッド

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H05K1/18 ,  H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: PROBLEM TO BE SOLVED: To provide a connecting structure which can improve the coupling reliability between substrates or a substrate and an electronic element. SOLUTION: An inserting body for interconnection between microelectronic circuit panels 260 has a contact point 250 on its surface. Each contact point has a center axis line orthogonal to the surface and a peripheral part which extends outward from the center axis line in a radial direction, in response to the force applied by a pad 262 of the engaged circuit panel. Thus, when the circuit panel 260 is compressed with the inserting body, the contact point is extended in the radial direction to wipe the pad 262. By this wiping action, coupling of the contact point to the pad by a conductive coupling material 246 supported by the contact point itself is facilitated. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供可以提高基板或基板与电子元件之间的耦合可靠性的连接结构。 解决方案：用于微电子电路板260之间的互连的插入体在其表面上具有接触点250。 每个接触点具有与表面正交的中心轴线和响应于被接合的电路板的焊盘262施加的力而从径向方向从中心轴线向外延伸的外围部分。 因此，当电路板260被插入体压缩时，接触点在径向方向上延伸以擦拭焊盘262.通过这种擦拭动作，通过导电耦合材料246将接触点耦合到焊盘，由 接触点本身便利。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：DE69532832T2

公开(公告)日：2005-01-13

申请号：DE69532832

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H04N9/877

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：DE69532832D1

公开(公告)日：2004-05-06

申请号：DE69532832

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H04N9/877

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：AT263477T

公开(公告)日：2004-04-15

申请号：AT99119308

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：DE69516725D1

公开(公告)日：2000-06-08

申请号：DE69516725

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：AT192609T

公开(公告)日：2000-05-15

申请号：AT95927327

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：DE69516725T2

公开(公告)日：2000-10-26

申请号：DE69516725

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：AU3138995A

公开(公告)日：1996-02-16

申请号：AU3138995

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R9/09

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.