公开(公告)号：JP2009260402A

公开(公告)日：2009-11-05

申请号：JP2009187292

申请日：2009-08-12

Applicant: Tessera Interconnect Materials Inc ,  テセラ・インターコネクト・マテリアルズ,インコーポレイテッド

Inventor： OHIRA HIROSHI ,  HARADA SATOSHI ,  IKENAGA KAZUO ,  ENDO KIMIYOSHI ,  IIJIMA ASAO

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To improve reliability in connection between a top surface of a metal bump of a wiring circuit board using the metal bump as an interlayer connection means and a wiring layer connected thereto, to improve an yield of the wiring circuit board, and further to improve electrical characteristics by enhancing an insulating part between wiring layers or between wiring circuit boards. SOLUTION: In the wiring circuit board, the top surface of a metal bump 28 and a wiring film 10 (16) connected thereto are connected by the direct metal bonding of metals, for example, copper-to-copper bonding. Furthermore, air or a foamed resin 12 containing air is used as an interlayer insulating film. Thus, reliability in the connection between the top surface of the metal bump and the wiring layer is improved, and the yield of the wiring circuit board can be enhanced. When interlayer insulation is implemented by using air or the foamed resin, the dielectric constant of an interlayer insulator is reduced to lower the parasitic capacitance of the wiring circuit board or an electronic circuit using the wiring board, thereby improving circuit characteristics and performance. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提高使用金属凸块作为层间连接装置的布线电路板的金属凸块的顶表面和与其连接的布线层之间的连接可靠性，以提高布线电路的产量 进一步通过增强布线层之间或布线电路板之间的绝缘部分来改善电特性。 解决方案：在布线电路板中，通过金属的直接金属接合（例如铜 - 铜）接合金属凸块28的上表面和与其连接的布线膜10（16）连接。 此外，使用含有空气的空气或发泡树脂12作为层间绝缘膜。 因此，提高了金属凸块的上表面与布线层之间的连接的可靠性，并且可以提高布线电路板的成品率。 当通过使用空气或发泡树脂实现层间绝缘时，层间绝缘体的介电常数降低，以降低布线电路板或使用布线板的电子电路的寄生电容，从而提高电路特性和性能。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：HK1073965A1

公开(公告)日：2005-10-21

申请号：HK05106338

申请日：2005-07-25

Applicant: TESSERA INTERCONNECT MATERIALS INC

Inventor： IIJIMA TOMOO ,  ENDO KIMITAKA ,  IKENAGA KAZUO ,  ODAIRA HIROSHI ,  MINARI NAOTO ,  KATO TAKASHI

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H05K20100101 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16 ,  H05K3/06 ,  H05K3/10 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

Abstract: A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.