公开(公告)号：JP2009088572A

公开(公告)日：2009-04-23

申请号：JP2009014166

申请日：2009-01-26

Applicant: Tessera Interconnect Materials Inc ,  テセラ・インターコネクト・マテリアルズ,インコーポレイテッド

Inventor： KATO TAKASHI

IPC: H05K3/40 ,  H05K1/09 ,  H05K3/06 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board capable of forming an insulating film, without exposing it to an etchant. SOLUTION: As shown in Fig.1(a), a multilayer metal plate is prepared, in which a wiring film forming metal layer 102 is formed on a releasable sheet 100, and a bump forming metal layer 104 is formed on the wiring film forming metal layer through an etching stopper layer 103. As shown in Fig.1(d), by etching the bump forming metal layer 104, bumps 107 are formed. As shown in Fig.1(f), resist 109 is applied on the surface of the bump forming layer 104 on which the bumps 107 are formed, and as shown in Fig.1(g), a resist 110 is formed by means of an exposure/development process. As shown in Fig.1(h), by etching the etching stopper layer 103 using the resist 110 as a mask, a wiring film 111 is formed. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造能够形成绝缘膜的布线电路板的方法，而不将其暴露于蚀刻剂。 解决方案：如图1（a）所示，制备多层金属板，其中在可剥离片材100上形成布线膜形成金属层102，并在其上形成凸起形成金属层104 通过蚀刻停止层103布线膜形成金属层。如图1（d）所示，通过蚀刻凸块形成金属层104，形成凸块107。 如图1（f）所示，在形成凸块107的凸点形成层104的表面上涂敷抗蚀剂109，如图1（g）所示，通过 曝光/开发过程。 如图1（h）所示，通过使用抗蚀剂110作为掩模蚀刻蚀刻停止层103，形成布线膜111。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：HK1073965A1

公开(公告)日：2005-10-21

申请号：HK05106338

申请日：2005-07-25

Applicant: TESSERA INTERCONNECT MATERIALS INC

Inventor： IIJIMA TOMOO ,  ENDO KIMITAKA ,  IKENAGA KAZUO ,  ODAIRA HIROSHI ,  MINARI NAOTO ,  KATO TAKASHI

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H05K20100101 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16 ,  H05K3/06 ,  H05K3/10 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

Abstract: A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.