公开(公告)号：HK1073965A1

公开(公告)日：2005-10-21

申请号：HK05106338

申请日：2005-07-25

Applicant: TESSERA INTERCONNECT MATERIALS INC

Inventor： IIJIMA TOMOO ,  ENDO KIMITAKA ,  IKENAGA KAZUO ,  ODAIRA HIROSHI ,  MINARI NAOTO ,  KATO TAKASHI

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H05K20100101 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16 ,  H05K3/06 ,  H05K3/10 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

Abstract: A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.