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公开(公告)号：JPH022944A
公开(公告)日：1990-01-08
申请号：JP14639088
申请日：1988-06-14
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO , YOSHIDA YOSHIHISA , IKEDA SADAO , YAMAKAWA TAKUMI
Abstract: PURPOSE:To make it possible to measure a material to be measured having closely arranged measuring points by providing a multilayered pattern between upper surface terminal and lower surface terminals. CONSTITUTION:An upper surface terminal 18 is provided in an upper surface. A lower surface terminal 19 is provided in a lower surface. Furthermore, one or more intermediate conductor layers are provided between the upper surface and the lower surface. The intermediate conductor layer is electrically conducted to the upper surface by way of through holes and also electrically conducted to the lower surface by way of through holes. In this way, the terminal 18 and the terminal 19 are electrically conducted through the intermediate conductor layer. Anisotropic conductive rubber sheets 17 are assembled on the surface of the upper surface and on the surface of the lower surface. Thus this device is utilized as a converter device 11. When grid-shaped probes 31 are compressed, they are electrically connected to measuring points 22 surely by the action of the springs of the probes 31. Under this state, short circuits and open states between the intended measuring points can be examined by examining short circuits and open states between the probes 31.
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公开(公告)号：JPH022943A
公开(公告)日：1990-01-08
申请号：JP14520688
申请日：1988-06-13
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO , YOSHIDA YOSHIHISA , IKEDA SADAO
Abstract: PURPOSE:To make it possible to perform wiring at one time and to make it possible to prevent erroneous wiring by using a circuit wiring board for wiring between an upper plate and a lower plate. CONSTITUTION:A connecting terminal 14 is provided in an upper plate. A probe hole 15 is provided at a position corresponding to a probe hole 16 in a lower plate. A circuit wiring board 17 is soldered at the part of each terminal 14. Finally, the probe 16 is inserted into the probe hole 15. The probe 16 is aligned to the position of each measuring point 22 of a body to be inspected 21. Further more, a grid-shaped probe 31 is aligned to the position of each terminal 14. When the grid-shaped probe 31 is compressed from the upper part the probe 16 is electrically connected to the measuring point 22 and to each lower surface terminal 19 securely utilizing the inclination of the spring of the probe 16. Under this state, short circuits and open states between the corresponding measuring points can be examined by examining short circuits and open states between the grid-shaped probes 31. Therefore, the wiring between the upper plate and the lower plate can be surely performed at one time.
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公开(公告)号：JPH0419575A
公开(公告)日：1992-01-23
申请号：JP12267190
申请日：1990-05-11
Applicant: TOPPAN PRINTING CO LTD
Inventor： YOSHIDA YOSHIHISA , IKEDA SADAO , SAKAI ITSUSEI , HOTTA MASAHIRO , TORIGOE TAKESHI
Abstract: PURPOSE:To make a preparation work easy and speedy and also to enable a prevention of error generation by making inspection points not positioned on grid points which are classified from the inspection points extracted from the connection informations of a wiring circuit board, to move to the grid point most adjacent thereto. CONSTITUTION:The connection informations such as wiring information, net information, land information, etc., from a CAD system used for the arrangement and wiring design of an object to be inspected, are inputted in a data input means 1. The inspection points are extracted therefrom in an arithmetic process means 5 and also the classification is made whether these points are positioned on the grid points settled beforehand or not, then the inspection points not positioned on the grid points are moved to the most adjacent one among the vacant grid points. The movement information of the inspection points is outputted by a magnetic disk device or a printer based on the movement result. Also, the result processed in the means 5 is stored in a storage means 4 as data base.
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公开(公告)号：JPH02269978A
公开(公告)日：1990-11-05
申请号：JP9213689
申请日：1989-04-12
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO , IKEDA SADAO , OHATA YUTAKA
Abstract: PURPOSE:To improve the accuracy of positioning with an inspection device by forming a groove and a hole at positions which are irrelevant to the inspection of the circuit wiring board (conversion board) for the inspection position converting device. CONSTITUTION:A top surface terminal 18 is provided on the top surface of the conversion plate 11 at a position corresponding to a lattice point of a measuring instrument and a rear surface terminal 19 is provided on the rear surface at a position corresponding to a measurement point 22 of a body 21 to be measured. When electric inspection is performed by using the conversion board 11, anisotropically conductive rubber sheets 17 are incorporated on the top and rear surfaces and this device is used as the converting device, but when a lattice probe 31 is pressed from above, the probe is securely connected electrically to the measurement point 22 through the operation of the spring of the probe 31 and the positions of the rear surface terminal 19 and measurement point 22 should match each other completely at this time. If they shift in position from each other, the conversion board 11 is dipped in water and swelled, but the groove 20 and hole are formed where wiring is not provided so as to accelerate the swelling, thereby securely and easily performing the positioning.
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Patent Agency Ranking
公开(公告)号：JPH022945A
公开(公告)日：1990-01-08
申请号：JP14639188
申请日：1988-06-14
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO , YOSHIDA YOSHIHISA , IKEDA SADAO , YAMAKAWA TAKUMI
Abstract: PURPOSE:To make it possible to inspect even a material to be inspected having closely arranged measuring points by providing the contact between a circuit wiring board and the measuring points with conductive ink that is provided at as lower-surface terminal part. CONSTITUTION:One or more intermediate conductor layers 15 are provided at a part other than an upper surface and a lower surface. Said conductor layer 15 and the upper and lower surfaces are electrically conducted by way of through-holes 14. In this way, an upper surface terminal 18 and a lower surface terminal 19 are electrically conducted through the conductor layer 15. Of course, a part where the through-hole 14 is not provided is constituted with an insulator 16. Conductive ink 41 is provided at the terminals 19. When grid shaped probes are compressed from the upper part, electric connection is surely provided even with the action of the springs of the probes. Therefore, short circuits and open states between the measuring points can be examined by examining short circuits and open states between the grid-shaped probes.
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公开(公告)号：JPH04208875A
公开(公告)日：1992-07-30
申请号：JP34057190
申请日：1990-11-30
Applicant: TOPPAN PRINTING CO LTD
Inventor： IKEDA SADAO , ADACHI TAKASHI
IPC: G01R31/02
Abstract: PURPOSE:To spread out an interval of probes and make short-circuit and open inspections for lead wires of narrow intervals by contacting simultaneously the probes to these units, making as a unit a pair of lead wires arranged mutually parallel at regular intervals in the form of a ground tint. CONSTITUTION:Probes 4a, 4b are concurrently contacted in one ends of a pairs of adjacent conductors 2a and 2b, 2e and 2f in lead wires 2a to 2i, etc., arranged parallel and at regular intervals. and probes 6a, 6b in the other ends of lead wires 2c and 2d, 2g and 2h. The presence of electric continuity between heads 4a and 6b, 6b and 4b, 4a and 6a is detected and the existence of a short-circuit is judged. Next, contacted conductors are shifted by one and a similar repetition is made. Thus, the short-circuit inspection of lead wires of narrow intervals can be made because prove intervals are spread out. Further, the open inspection of lead wires also is made in the same way.
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公开(公告)号：JPH03282376A
公开(公告)日：1991-12-12
申请号：JP8433090
申请日：1990-03-30
Applicant: TOPPAN PRINTING CO LTD
Inventor： YOSHIDA YOSHIHISA , IKEDA SADAO
Abstract: PURPOSE:To attain an inspection of short-circuit and open-circuit on a circuit wiring board for both sides at the same time with a simple constitution by arranging conversion substrates at both upper and lower sides of the circuit wiring board and giving/receiving a signal for wiring patterns on both sides of the circuit wiring board at the same time through probes. CONSTITUTION:When the conversion substrates 3, 4 are arranged at specified positions, contacts 9 formed on the upper surface of substrate 3 are connected with the wiring pattern 7 on the upper surface of circuit wiring board 2 through conductive members 10, contacts 8 and pressure sensitive rubber 14. On the other hand contacts 20 formed on the upper surface of connection part 16 are connected with the wiring pattern 7 on the lower surface of wiring board 2 through the contacts 9, conductive members 10, contacts 8, and rubber 14. So, when the signal is supplied to the probes 12, the signal is given at the same time to the patterns 7 formed on both sides of the wiring board 2 and also received from the patterns 7 at the same time, thereby the short-circuit and open-circuit can be inspected for both sides at the same time. Consequently, the constitution is made simple and the cost can be reduced, since the probes 12 are enough to be arranged only on the upper side of wiring board 2.
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公开(公告)号：JPH0243796A
公开(公告)日：1990-02-14
申请号：JP19507588
申请日：1988-08-04
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO , YOSHIDA YOSHIHISA , IKEDA SADAO , YAMAKAWA TAKUMI
Abstract: PURPOSE:To realize a pattern forming method in which the formation of a contact point is facilitated by a method wherein a second contact point of a conversion substrate on a checked substrate side is formed making use of a mask, which has been used for the formation of a wiring pattern of the checked substrate, in such a manner that the mask is reversed or a figure data for the use in the formation of the mask of the checked substrate. CONSTITUTION:A conversion substrate 14 is arranged between a check jig 16 provided with relay terminals 20 formed in grating and a checked substrate 11 provided with a wiring pattern 12 formed on its side which faces the check jig 16, where the substrate 14 is provided with first contact points 17, which are formed on its side that faces the check jig 16 and electrically connected to the above relay terminals 20, and second contact points 18 which are formed on the other side that faces the checked substrate 11 and electrically connected with the wiring pattern 12 of the checked substrate 11. The above conversion substrate 14 is pattern-formed in such a manner that a mask, which has been used for the formation of the wiring pattern 12 of the checked substrate 11, is used as being reversed or a figure data for the use in the formation of a mask of the checked substrate 11 is used to form the second contact points 18 of the conversion substrate 14. By these process, the formation of the contact points of the conversion substrate can be facilitated and it can be surely checked that the checked substrate is defective or not.
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公开(公告)号：JPH05119098A
公开(公告)日：1993-05-14
申请号：JP28147291
申请日：1991-10-28
Applicant: TOPPAN PRINTING CO LTD
Inventor： IKEDA SADAO , SUKAI EIJI
IPC: G01R31/02
Abstract: PURPOSE:To efficiently inspect the wiring of a printed wiring board with high accuracy by providing movable elastic probes through which wire pins having restoring properties are slidably passed in the vertical direction at the positions of energizing sections to be inspected on a pair of an upper and lower supporting plates facing each other at an interval. CONSTITUTION:After a grid converting jig plate 20 is positioned on a lower universal head 12 by putting hole sections 23 provided at both end sections of the plate 20 on positioning projections 15 provided on both end sections of the head 12, positioning pins 80 are inserted into hole sections 24 on the upper surface of the plate 20. Then the head 12 is raised to a prescribed position by moving an elevating means 11 upward. Thereafter, the propriety of a wiring board 1 is discriminated by conducting the part to be inspected of the board 1 which is in contact with the terminal sections of wires 41 and 51 by making a testing current to flow between and applying a testing voltage across an upper universal head 16 and the lower head 12 while the plate 20, a jig plate 30 for inspection, mobile wire rope 40, printed wiring board 1, mobile wire rope 50, jig plate 23 for inspection, and grid converting jig plate 25 put between an upper universal head 16 and the lower head 12 are compressed with a prescribed pressure.
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