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公开(公告)号：JP2002062313A
公开(公告)日：2002-02-28
申请号：JP2000250756
申请日：2000-08-22
Applicant: TOPPAN PRINTING CO LTD
Inventor： AKIYAMA YUKIO , YOSHIDA YOSHIHISA , SHIBAYAMA TAKAHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an electrical inspection jig which is highly finer than a conventional electric inspection jig and to provide its manufacturing method. SOLUTION: Two retainer plates 21a and 21b, in which through-holes 22 formed at prescribed positions are faced so as to be fixed by a fixation jig 31, and conductive wires 11 are inserted into the through-holes 22 in the respective retainer plates 21a and 21b. An insulation fixing part 41, into which an insulating resin is poured so as to be hardened, is formed between the retainer plates 21a and 21b and is cut at a cutting line 23. Then, the conductive wires 11 are fixed to prescribed positions of an insulating substrate 41a, and it is possible to obtain the electric inspection jig 100, in which exposed parts 11a of the linear conductive wires 11 are formed on one face of the insulating substrate 41a and in which the linear conductive wires 11 in prescribed lengths are formed on the other face.
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公开(公告)号：JP2002005980A
公开(公告)日：2002-01-09
申请号：JP2000181156
申请日：2000-06-16
Applicant: TOPPAN PRINTING CO LTD
Inventor： YOSHIDA YOSHIHISA , SHIBAYAMA TAKAHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an inspection jig for precisely inspecting a conduction/ insulation state of a high wiring density printed wiring board having a warp/ deflection, an inspection device, and positioning method using the inspection device. SOLUTION: The printed wiring board 22 as an inspected body is clamped between the inspection jigs 10, 20 respectively constructed of first insulating boards 1, 11, second insulating boards 2, 12, probes 3, 13, image guides 4, 14, clearance deciding mechanisms 70, 80, and elastic members 7, 17 for correcting a warp/deflection of the printed wiring board 22, and after correction of the warp/deflection of the printed wiring board 22, its conduction/insulation state is inspected by means of the inspection device 100 provided with a pressurizing means 110, a positioning means 120, a conduction/insulation measuring means 130, a determining means 140, a determined result outputting means 150 necessary for an inspection process.
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公开(公告)号：JPH0786459A
公开(公告)日：1995-03-31
申请号：JP22708093
申请日：1993-09-13
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO
IPC: H01L23/28
Abstract: PURPOSE:To make it hard to crack sealing resin, especially in the edge part of a printed wiring board and in the part closely adhering to the corner part even due to a thermohysteresis loop by bevelling corners to be included in sealing resin of the printed wiring board. CONSTITUTION:A printed wiring board 20 is manufactured by using, for instance, a copper-clad laminated plate of glass epoxy for pattern forming by etching and laminating followed by performing processing of an external form. Thereby, an angle of a router used for processing of an external form is changed for performing cornering of an angle 22. Further, a corner part is lightly ground by a buff so as to remove burrs. Then, the printed wiring board 20 is pasted up on a lead frame 30 processed by etching using an adhesive and a plurality of semiconductor chips 10 are mounted for wire bonding followed by resin sealing so as to include overall the printed wiring board in order to obtain a semiconductor device. Thereby, stress due to a difference in a thermal expansion difference coefficient between the printed wiring board sealing resin is avoided from being concentrated especially on the corner part of the printed wiring board.
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公开(公告)号：JPH0341766A
公开(公告)日：1991-02-22
申请号：JP17669589
申请日：1989-07-07
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO , YAMAMOTO KATSUMI
Abstract: PURPOSE:To check up the dispersion of photodetecting element per relative inspection section regardless of the dispersion in inspection section of inspecting light source by a method wherein the output per inspection of the photodetecting element are measured in combination of the whole inspection sections of an inspection light source. CONSTITUTION:A photodetecting element as a solid image pick-up element on an irradiating region 17 is irradiated with even light emitted from a light source 11 through the intermediary of a condenser lens 12, a filter 13, a pattern 14, a projection lens 15 and a diaphragm 16 and then respective inspection regions a, b, c, d are aligned with the other respective inspection regions A, B, C, D so as to specify the respective outputs to be VaA, VbB, VcC, VdD. Next, the photodetecting element is turned by 90 deg. using its center as a turning core while the inspecting regions b, c, d, a are aligned with the irradiating region 17 of the even light source so as to obtain respective outputs of VbA, VcB, VdC. VaD. Likewise, the photodetecting element is further turned by 90 deg. respectively to obtain VcA, VdB, VaC VdD and VdA, VaB, VbC, VcD.
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公开(公告)号：JPH0243796A
公开(公告)日：1990-02-14
申请号：JP19507588
申请日：1988-08-04
Applicant: TOPPAN PRINTING CO LTD
Inventor： SHIBAYAMA TAKAHIRO , YOSHIDA YOSHIHISA , IKEDA SADAO , YAMAKAWA TAKUMI
Abstract: PURPOSE:To realize a pattern forming method in which the formation of a contact point is facilitated by a method wherein a second contact point of a conversion substrate on a checked substrate side is formed making use of a mask, which has been used for the formation of a wiring pattern of the checked substrate, in such a manner that the mask is reversed or a figure data for the use in the formation of the mask of the checked substrate. CONSTITUTION:A conversion substrate 14 is arranged between a check jig 16 provided with relay terminals 20 formed in grating and a checked substrate 11 provided with a wiring pattern 12 formed on its side which faces the check jig 16, where the substrate 14 is provided with first contact points 17, which are formed on its side that faces the check jig 16 and electrically connected to the above relay terminals 20, and second contact points 18 which are formed on the other side that faces the checked substrate 11 and electrically connected with the wiring pattern 12 of the checked substrate 11. The above conversion substrate 14 is pattern-formed in such a manner that a mask, which has been used for the formation of the wiring pattern 12 of the checked substrate 11, is used as being reversed or a figure data for the use in the formation of a mask of the checked substrate 11 is used to form the second contact points 18 of the conversion substrate 14. By these process, the formation of the contact points of the conversion substrate can be facilitated and it can be surely checked that the checked substrate is defective or not.
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Patent Agency Ranking
公开(公告)号：JPH01120342A
公开(公告)日：1989-05-12
申请号：JP27889787
申请日：1987-11-04
Applicant: TOPPAN PRINTING CO LTD
Inventor： KAWAKAMI YOSHITO , YAMANAKA TAKEHIKO , SASAKI HIDEO , SHIBAYAMA TAKAHIRO , IKEGAMI TAKASHI
Abstract: PURPOSE:To reduce power cost, by converting the waste heat in exhaust gas to electric energy by arranging a thermoelectric converter element to recover the same and using said electric energy as the power supply of electric machinery. CONSTITUTION:After printing paper 2 is dried, the generated exhaust gas is sent into a deodorizing apparatus 3 to be reheated by a burner 5' and subjected to decompositional reaction by a catalyst to generate exhaust gas. The temp. difference between this exhaust gas and the open air passing through an open air duct arranged in close vicinity to said reaction exhaust gas is utilized and heat energy is converted to electric energy by a thermoelectric converter 6 having a thermoelectric converter element to recover waste heat. The thermoelectric converter 6 is constituted of the plate-shaped thermoelectric converter element and the heat conductors extended from both ducts are arranged so as to be brought into contact with the surface of the thermoelectric converter element. The thermoelectric converter element is a semiconductor capable of converting heat to electricity or converting electricity to cooling energy.
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公开(公告)号：JPS60238771A
公开(公告)日：1985-11-27
申请号：JP9472984
申请日：1984-05-14
Applicant: TOPPAN PRINTING CO LTD , TOTSUPAN PURESHIJIYON BOODO KK
Inventor： SHIBAYAMA TAKAHIRO , YOSHIDA YOSHIHISA
IPC: G01R31/02
Abstract: PURPOSE:To improve an inspecting speed by providing a changeover switch group for switching selectively a connection between probe group blocks divided into three having probes of the number corresponding to a wiring inspecting terminal, and two switch group blocks in the prescribed number of combinations. CONSTITUTION:A probe 48 of a probe group block 36 is connected to a fire line 18 or a sense line 20 connected to a data output part by a switch 52 of a switch group block 42 through a changeover switch group 46. Also, a probe 60 of a probe group block 38 is connected to the line 18 or the line 20 by the switch 52 of a switch group 42 or the switch 58 of a switch group block 44 through the changeover switch group 46. Moreover, the probe 54 of a probe group block 40 is connected to the line 18 or the line 20 by the switch 58 of the switch group 44 through the changeover switch group 46. In such a way, switch groups corresponding to all of the probe groups 36, 38 and 40 come to exist apparently, and a conventional mechanical movement can be executed by an electric switching.
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公开(公告)号：JP2002174657A
公开(公告)日：2002-06-21
申请号：JP2000374107
申请日：2000-12-08
Applicant: TOPPAN PRINTING CO LTD
Inventor： AKIYAMA YUKIO , YOSHIDA YOSHIHISA , SHIBAYAMA TAKAHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a high definition tool for electrical inspection. SOLUTION: In this tool for electrical inspection, a through hole 12 is formed in a prescribed position of a plate 11 comprising an insulating material, a conductive liquid 21 is filled inside the through hole 12, one end part of a conductive wire rod 31 contacts with the conductive liquid 21, and the other end part of the wire rod 31 is connected to a terminal of a tester for the electrical inspection directly as a lead wire, or through a connector or a terminal block.
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公开(公告)号：JPH112653A
公开(公告)日：1999-01-06
申请号：JP15653597
申请日：1997-06-13
Applicant: TOPPAN PRINTING CO LTD
Inventor： YOSHIDA YOSHIHISA , SHIBAYAMA TAKAHIRO
Abstract: PROBLEM TO BE SOLVED: To accurately inspect a printed wiring plate apt to buckle by contacting a jig to the backside of an inspection point in contacting two probes for inspection to the inspection point of an inspecting printed wiring plate. SOLUTION: A printed wiring plate 1 to be inspected is held with a holding mechanism and two probes 3 for inspection proper for an inspection point 5 are selected from probes 3 groups of probes for inspection. When the probes 3 for inspection is moved and they are contacted to the inspection point 5 of the printed wiring plate 1, a jig 4 is simultaneously contacted to the backside of the inspection point 5. Owing to the contact of the jig 4, the buckling of the printed wiring plate 1 to be inspected is prevented by the pushing pressure of the probes 3 for inspection and the probes 3 for inspection can be contacted to the inspection point 5 with proper force. In this method, stronger contact force considering the buckling becomes unnecessary and the printed wiring plate 1 to be inspected will never be damaged.
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公开(公告)号：JPH10170582A
公开(公告)日：1998-06-26
申请号：JP32979696
申请日：1996-12-10
Applicant: TOPPAN PRINTING CO LTD
Inventor： YOSHIDA YOSHIHISA , SHIBAYAMA TAKAHIRO
Abstract: PROBLEM TO BE SOLVED: To attain high reliability of inspection of printed wiring board with a high wiring density. SOLUTION: If a second insulation substrate 27A is pushed to a printed wiring board side in the state that a penetration hole 38A of the first insulation substrate 29A and the inspection point of a printed wiring board 21 overlap each other, both insulation substrates approach to each other, tip ends of each probe 34A in each penetration hole 38A of the first insulation substrate approach the inspection points and spring member 33A shrinks. After the tip ends of each probe touch the inspection points, as each probe 34A bends between the second insulation substrate and the printed wiring board, it gives pushing pressure to each inspection point. When the gap between the first and the second insulation substrates 29A and 27A becomes minimum, a ring member 33A touches the both substrates to terminate the approach and each probe stops increase of the pushing pressure given to the inspection points to optimize the pushing pressure and forms a state capable of inspection.
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