RESIN AND PHOTOSENSITIVE RESIN COMPOSITION

    公开(公告)号:SG11201701691PA

    公开(公告)日:2017-04-27

    申请号:SG11201701691P

    申请日:2015-08-24

    Abstract: The purpose of the present invention is to provide a resin that is capable of producing a photosensitive resin composition having high sensitivity and high film retention ratio. The present invention provides a resin which has a polyamide structure, a polyimide precursor structure or a polyimide structure wherein an acid having an alicyclic structure with 6-40 carbon atoms or a semi-alicyclic structure with 6-40 carbon atoms or an anhydride of the acid is contained in an amount of 5-95% by mole if the total amount of acids or anhydrides thereof is taken as 100% by mole.

    2.
    发明专利
    未知

    公开(公告)号:DE69827429T2

    公开(公告)日:2005-11-10

    申请号:DE69827429

    申请日:1998-05-15

    Abstract: An actinic radiation sensitive polymer composition containing (a) a polyimide precursor obtainable by the interaction of an amine compound having a photocrosslinking group with carboxyl groups of a poly(amic acid) chain, and (b) a photoinitiator and/or photosensitizer, in which the degree of imidization Ia is 0.03 ≤ Ia ≤ 0.6, has the characteristic features of both good stability of viscosity with lapse of time and good photosensitive performance.

    7.
    发明专利
    未知

    公开(公告)号:DE69827429D1

    公开(公告)日:2004-12-16

    申请号:DE69827429

    申请日:1998-05-15

    Abstract: An actinic radiation sensitive polymer composition containing (a) a polyimide precursor obtainable by the interaction of an amine compound having a photocrosslinking group with carboxyl groups of a poly(amic acid) chain, and (b) a photoinitiator and/or photosensitizer, in which the degree of imidization Ia is 0.03 ≤ Ia ≤ 0.6, has the characteristic features of both good stability of viscosity with lapse of time and good photosensitive performance.

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