公开(公告)号：SG122901A1

公开(公告)日：2006-06-29

申请号：SG200507109

申请日：2005-11-18

Applicant: TORAY INDUSTRIES

Inventor： SUWA MITSUHITO ,  FUJIWARA TAKENORI ,  SENOO MASAHIDE ,  IIMORI HIROKAZU

Abstract: This invention provides a positive photosensitive siloxane composition having high photosensitivity and having such properties as high heat resistance, high transparency and low dielectric constant, used to form a planarization film for a TFT substrate, an interlayer dielectrics or a core or cladding of an optical waveguide. It is a positive photosensitive siloxane composition comprising a siloxane polymer, quinonediazide compound and solvent, characterized in that the light transmittance of the cured film formed of the composition per 3 µm of film thickness at a wavelength of 400 nm is 95% or more.

公开(公告)号：SG11201402918VA

公开(公告)日：2014-10-30

申请号：SG11201402918V

申请日：2012-12-21

Applicant: TORAY INDUSTRIES

Inventor： FUJIWARA TAKENORI ,  TANIGAKI YUGO ,  SUWA MITSUHITO

IPC: G03F7/004 ,  G03F7/075 ,  G03F7/023 ,  G03F7/038 ,  G03F7/09

Abstract: Disclosed is a photosensitive resin composition which exhibits positive or negative photosensitivity and is used as a mask in an ion implantation step, the photosensitive resin composition including, as a resin, (A) a polysiloxane. The photosensitive resin composition of the present invention has high heat resistance and is capable of controlling a pattern shape, and also has excellent ion implantation mask performance, thus enabling application to a low-cost high-temperature ion implantation process.

公开(公告)号：MY180132A

公开(公告)日：2020-11-23

申请号：MYPI2016700310

申请日：2013-08-02

Applicant: TORAY INDUSTRIES

Inventor： DAN KOICHI ,  SUWA MITSUHITO ,  SHIMIZU HIROJI ,  MURASE SEIICHIRO ,  FUJIMORI SHIGEO ,  FUJIWARA TAKENORI

Abstract: There is provided a mask paste composition having superior cracking resistance and masking properties in a post-application impurity diffusion step, superior patterning properties during application, and superior storage stability of its pre-cured solution by means of a mask paste composition characterized by including (a) a specific polysiloxane, (b) silica particles having an average particle diameter of not greater than 150 nm, and (c) a solvent having a boiling point of not lower than 130? C, wherein the weight average molecular weight of (a) the polysiloxane is not less than 1000, the content of the silica particles in the solid fraction of the composition is 20% by weight to 70% by weight, and the concentrations of P, B and Al in the entire composition are each not more than 20 ppm.

公开(公告)号：SG10202000399YA

公开(公告)日：2020-03-30

申请号：SG10202000399Y

申请日：2015-08-05

Applicant: TORAY INDUSTRIES

Inventor： ARIMOTO SHINJI ,  FUJIWARA TAKENORI ,  TOMIKAWA MASAO

Abstract: The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention is a temporary-bonding adhesive characterized by being a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol% of the (A1) residue and 0.01-60 mol% of the (B1) residue.

公开(公告)号：SG11201708729TA

公开(公告)日：2017-11-29

申请号：SG11201708729T

申请日：2016-04-20

Applicant: TORAY INDUSTRIES

Inventor： FUJIWARA TAKENORI ,  TANIGAKI YUGO

IPC: C08L79/08 ,  C08L79/04 ,  G03F7/004 ,  G03F7/023 ,  G03F7/09 ,  G03F7/40 ,  G03F7/42

Abstract: Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1). The resin composition allows high resolution and a pattern form to be maintained even after high temperature processing, and is applicable as a photoresist that can be peeled off after processing.

公开(公告)号：SG11201700692RA

公开(公告)日：2017-03-30

申请号：SG11201700692R

申请日：2015-08-05

Applicant: TORAY INDUSTRIES

Inventor： ARIMOTO SHINJI ,  FUJIWARA TAKENORI ,  TOMIKAWA MASAO

IPC: C09J179/08 ,  C08G73/10 ,  C08K5/544 ,  C08L79/08 ,  C08L83/04 ,  C09J7/00 ,  C09J11/06 ,  C09J183/04 ,  C11D7/50 ,  H01L21/02 ,  H01L21/304

Abstract: The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention is a temporary-bonding adhesive characterized by being a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol% of the (A1) residue and 0.01-60 mol% of the (B1) residue.

公开(公告)号：MY171248A

公开(公告)日：2019-10-04

申请号：MYPI2014701731

申请日：2012-12-21

Applicant: TORAY INDUSTRIES

Inventor： FUJIWARA TAKENORI ,  TANIGAKI YUGO ,  SUWA MITSUHITO

IPC: G03F7/004 ,  G03F7/022

Abstract: Disclosed is a photosensitive resin composition which exhibits positive or negative photosensitivity and is used as a mask in an ion implantation step, the photosensitive resin composition including, as a resin, (A) a polysiloxane. The photosensitive resin composition of the present invention has high heat resistance and is capable of controlling a pattern shape, and also has excellent ion implantation mask performance, thus enabling application to a low-cost high-temperature ion implantation process.

公开(公告)号：SG11201805612PA

公开(公告)日：2018-07-30

申请号：SG11201805612P

申请日：2017-02-03

Applicant: TORAY INDUSTRIES

Inventor： ARIMOTO SHINJI ,  FUJIWARA TAKENORI ,  OKAZAWA TORU

IPC: C08L79/08 ,  B32B27/00 ,  B32B27/34 ,  B32B27/38 ,  C08K3/00 ,  C08K5/5415 ,  C08L63/00 ,  C08L83/04 ,  C09D163/00 ,  C09D179/08 ,  C09D183/04 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  C09J183/04 ,  H01L21/304

Abstract: A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

公开(公告)号：SG11201802510SA

公开(公告)日：2018-04-27

申请号：SG11201802510S

申请日：2016-10-24

Applicant: TORAY INDUSTRIES

Inventor： ODA TAKURO ,  ARIMOTO SHINJI ,  FUJIWARA TAKENORI

IPC: B32B27/00 ,  B32B27/34 ,  C09J7/00 ,  C09J11/04 ,  C09J11/06 ,  C09J179/08 ,  C09J183/04 ,  C09J183/08 ,  H01L21/304

Abstract: The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.

公开(公告)号：SG188386A1

公开(公告)日：2013-04-30

申请号：SG2013015979

申请日：2011-08-30

Applicant: TORAY INDUSTRIES

Inventor： FUJIWARA TAKENORI ,  SUWA MITSUHITO ,  UCHIDA KEIICHI ,  FUKUHARA SHO ,  SENOO MASAHIDE

Abstract: The present invention provides a positive photosensitive composition comprising (A) an alkali-soluble resin, (B) a naphthoquinone diazide compound, (C) a solvent and (D) a metal chelate compound, which is characterized in that the (D) 5 metal chetate compound has a structure represented by the following Fomiula (1)and the content of the (D) metal chelate compound is 0.1 to 5 pans by weight compared to 110 parts by weight of the (A) alkali-soluble resin.The positive photosensitive composition of the present invention has characteristic features such as high heat resistance and high transparency as well as 10 excellent adhesion in development and wet-heat resistance.