公开(公告)号：PH12016501392A1

公开(公告)日：2017-02-06

申请号：PH12016501392

申请日：2016-07-14

Applicant: TORAY INDUSTRIES

Inventor： ODA TAKURO ,  KANAMORI DAISUKE ,  NONAKA TOSHIHISA

IPC: C09J11/06 ,  C09J7/02 ,  C09J11/04 ,  C09J163/00 ,  C09J179/08 ,  H01L21/60

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt pcnt to 30 wt pcnt , the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt pcnt to 10 wt pcnt , and T/M being 400 to 8000, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

公开(公告)号：PH12016501392B1

公开(公告)日：2017-02-06

申请号：PH12016501392

申请日：2016-07-14

Applicant: TORAY INDUSTRIES

Inventor： ODA TAKURO ,  KANAMORI DAISUKE ,  NONAKA TOSHIHISA

IPC: C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  H01L21/60

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt pcnt or more and 30 wt pcnt or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt pcnt or more and 10 wt pcnt or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

公开(公告)号：SG11201802510SA

公开(公告)日：2018-04-27

申请号：SG11201802510S

申请日：2016-10-24

Applicant: TORAY INDUSTRIES

Inventor： ODA TAKURO ,  ARIMOTO SHINJI ,  FUJIWARA TAKENORI

IPC: B32B27/00 ,  B32B27/34 ,  C09J7/00 ,  C09J11/04 ,  C09J11/06 ,  C09J179/08 ,  C09J183/04 ,  C09J183/08 ,  H01L21/304

Abstract: The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.

公开(公告)号：SG11201605819SA

公开(公告)日：2016-08-30

申请号：SG11201605819S

申请日：2015-01-09

Applicant: TORAY INDUSTRIES

Inventor： ODA TAKURO ,  KANAMORI DAISUKE ,  NONAKA TOSHIHISA

IPC: C09J179/08 ,  C09J7/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  H01L21/60

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.