中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

23 records (took 0.024 seconds)

    CURABLE RESIN COMPOSITION FOR PREPREG
    2.
    发明专利
    CURABLE RESIN COMPOSITION FOR PREPREG 失效

    公开(公告)号：JPS6354418A

    公开(公告)日：1988-03-08

    申请号：JP19729086

    申请日：1986-08-25

    Applicant: TORAY INDUSTRIES

    Inventor： KUBODERA KAZUNAO ,  NAKAE TAKEJI ,  HASUMI SHIGERU

    IPC: C08J5/24 ,  C08G59/00 ,  C08G59/18 ,  C08L61/00 ,  C08L61/34 ,  C08L63/00

    Abstract: PURPOSE:To obtain the title composition which can give a cured product excellent in heat resistance, water resistance and toughness, by mixing an epoxy compound with a cyanate resin, a polysulfone resin and a specified bis(hydroxyphenyl) sulfone or its formalin condensate. CONSTITUTION:A mixture obtained by mixing an epoxy compound (A) having at least two epoxy groups in the molecule (e.g., bisphenol A-derived epoxy resin) with a polycyanate (prepolymer) (B) having at least two cyanato groups in the molecule or a mixture thereof with a polymaleimide (prepolymer) (B) having at least two maleimide groups in the molecule at 9:1-2:8 is mixed with 6-60pts.wt. per 100pts.wt. component B, polysulfone resin (C) of formula I (wherein Ar is a group of formula II, III or IV) and 0.5-20pts.wt., per 100pts.wt. component A, bis(hydroxyphenyl) sulfone of formula VI or its formaline condensate (D).

    PRODUCTION OF RESIN COMPOSITION FOR PREPREG
    3.
    发明专利
    PRODUCTION OF RESIN COMPOSITION FOR PREPREG 失效

    公开(公告)号：JPS62185720A

    公开(公告)日：1987-08-14

    申请号：JP2673486

    申请日：1986-02-12

    Applicant: TORAY INDUSTRIES

    Inventor： SUZUE SHIGERU ,  HASUMI SHIGERU ,  MURAKI TOSHIO

    IPC: C08J5/24 ,  C08G59/00 ,  C08G59/50 ,  C08L63/00 ,  C08L79/04 ,  C08L81/06

    Abstract: PURPOSE:To produce the titled high-quality composition within a short time, by dissolving a specified ground thermoplastic resin in an epoxy resin and mixing the resulting solution with a cyanic ester resin. CONSTITUTION:100-20wt% cyanic ester of formula I (wherein R is an aromatic organic group and m is 2-5) and 0-80wt% maleimide of formula II (wherein R is a bi- to penta-valent aromatic or aliphatic organic group and m is 2-5) are prepolymerized at 80-160 deg.C for 1-4hr to obtain a cyanic ester (C). A thermoplastic resin of a glass transition temperature >=100 deg.C (e.g., polyether sulfone) is ground with an impact mill and classified to obtain a thermoplastic resin powder (A) of a particle diameter

    PREPREG FOR COMPOSITE MATERIAL
    4.
    发明专利
    PREPREG FOR COMPOSITE MATERIAL 失效

    公开(公告)号：JPS63205328A

    公开(公告)日：1988-08-24

    申请号：JP3671487

    申请日：1987-02-19

    Applicant: TORAY INDUSTRIES

    Inventor： HASUMI SHIGERU ,  KAWAZU YUKIO ,  HIRAMATSU TORU

    IPC: C08J5/06 ,  C08G73/06 ,  C08G73/08 ,  C08J5/24

    Abstract: PURPOSE:To obtain a prepreg which can give a composite material excellent in water and impact resistances in a high-temperature wet state, by using a carbon fiber subjected to a specified surface treatment and a cyanate resin as essential component. CONSTITUTION:A prepreg for composite materials which essentially consists of a carbon fiber (A) (preferably of an elongation >=1.6%) having a nitrogenous functional group content (NIS/CIS) on the surface of the carbon fiber (as determined by X-ray photoelectron spectroscopy) in the range of 0.06-0.25 and a cyanate resin (B) [e.g., (a) a polycyanate and/or a prepolymer thereof of a resin composition (b) obtained by mixing or pre-reacting a polymaleimide with said component (a)] and optionally contains an epoxy resin and a polysulfone resin. This prepreg is excellent in the resistance to acid, water and impact in a high-temperature wet state. Said resin A can be obtained by subjecting a carbon fiber to electrolysis in an ammonium ion-containing electrolyte solution by using the fiber as an anode.

    CURABLE RESIN COMPOSITION
    7.
    发明专利
    CURABLE RESIN COMPOSITION 失效

    公开(公告)号：JPS6366219A

    公开(公告)日：1988-03-24

    申请号：JP20960186

    申请日：1986-09-08

    Applicant: TORAY INDUSTRIES

    Inventor： KUBODERA KAZUNAO ,  NAKAE TAKEJI ,  HASUMI SHIGERU

    IPC: C08G59/62 ,  C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08L63/00

    Abstract: PURPOSE:To obtain the titled composition, containing a specific epoxy resin, cyanic acid ester based resin and sulfone based compound, having excellent water and heat resistance and capable of giving cured resin articles suitable as matrix resins for prepreg of FRP and IC sealing media. CONSTITUTION:A composition containing (A) an epoxy compound having >=2 epoxy groups in one molecule, (B) a cyanic acid ester based resin and (C) a sulfone based compound expressed by the formula (n and m are integers of >=1; R is H or CH3). Furthermore, the component (A) preferably consists of (i) polyfunctional cyanic acid esters (prepolymer blend) containing >=2 cyanate groups in one molecule or together with (ii) polyfunctional maleimides (prepolymer blend) containing >=2 maleimide groups in the molecule.

    EPOXY RESIN COMPOSITION FOR PREPREG
    8.
    发明专利
    EPOXY RESIN COMPOSITION FOR PREPREG 失效

    公开(公告)号：JPS6257417A

    公开(公告)日：1987-03-13

    申请号：JP19607885

    申请日：1985-09-06

    Applicant: TORAY INDUSTRIES

    Inventor： NAKAHARA MASANORI ,  HASUMI SHIGERU ,  MURAKI TOSHIO

    IPC: C08G59/00 ,  C08G59/20 ,  C08G59/28 ,  C08G59/32 ,  C08G59/40 ,  C08G59/50 ,  C08L63/00 ,  C08L81/06

    Abstract: PURPOSE:The titled composition having improved toughness, heat resistance, water resistance and tack.draping properties, containing specific components such as tetraglycidyldiaminodiphenylmethane, bisphenol A type epoxy resin, diaminodiphenylsulfone, etc. CONSTITUTION:(A) N,N,N',N'-Tetraglycidyldiaminodiphenylmethane is blended with (B) bisphenol A type epoxy resin shown by the formula I (G is group shown by the formula II), (C) bisphenol F type epoxy resin, (D) diaminodiphenylsulfone and (E) a polyether sulfone shown by the formula III, as essential components, to give the aimed composition.

    THERMOSETTING RESIN COMPOSITION FOR COMPOSITE MATERIAL
    9.
    发明专利
    THERMOSETTING RESIN COMPOSITION FOR COMPOSITE MATERIAL 失效

    公开(公告)号：JPS6236460A

    公开(公告)日：1987-02-17

    申请号：JP17564885

    申请日：1985-08-12

    Applicant: TORAY INDUSTRIES

    Inventor： MURAKI TOSHIO ,  NAKAHARA MASANORI ,  HASUMI SHIGERU

    IPC: C08J5/24 ,  C08L79/00 ,  C08L79/04 ,  C08L79/08 ,  C08L81/06

    Abstract: PURPOSE:To provide the titled compsn. which gives a composite material having a high mechanical strength at a high temp. and excellent toughness and heat resistance, consisting of a polyfunctional cyanate ester having a specified composition, a bismaleimide and a polysulfone. CONSTITUTION:A polyfunctionl cyanate ester (A) of formula I (wherein R is a residue of an arom. hydrocarbon formed by removing OH groups from a polyfunctional phenol compd.; n is at least 2), a bismaleimide (B) derived from maleic anhydride and an arom. diamine (e.g. m-phenylenediamine) and a polysulfone (C) of formula II (wherein n s 10-150) are blended in a weight ratio of A/B of 100/0-40/60 and C/(A+B+C) of 5/100-50/100.

Patent Agency Ranking