SPECTROSCOPIC METHOD AND METHOD FOR FORMING FILM

    公开(公告)号:JP2001356050A

    公开(公告)日:2001-12-26

    申请号:JP2000178061

    申请日:2000-06-14

    Abstract: PROBLEM TO BE SOLVED: To provide a spectroscopic method with small errors, a method for measuring a thickness and a method using these methods for forming films. SOLUTION: An incident light is brought into a light dispersion means to split the light for each wavelength. The split light of each wavelength is brought into a conversion means for converting the light to an electrical signal corresponding to an intensity of the light. In obtaining a spectroscopic spectrum from the obtained electrical signal, the wavelength of the light entering a specific position on the conversion means is determined by a calibration expression derived from characteristics of the light dispersion means.

    WEB THICKNESS MEASURING DEVICE AND WEB MANUFACTURING METHOD

    公开(公告)号:JP2002277217A

    公开(公告)日:2002-09-25

    申请号:JP2001075994

    申请日:2001-03-16

    Abstract: PROBLEM TO BE SOLVED: To provide a thickness measuring device in which accuracy in the measurement of web thickness is improved and a web manufacturing method in which variations in the thickness of a web is substantially reduced. SOLUTION: A measuring part 7 of a light-interference thickness gauge is made to scan the traveling web W in the widthwise direction of the web to detect wavelengths which indicate a maximum value and a minimum value in a wavelength intensity distribution by the interference between two types of reflected lights I and II at the surface and back surface of the web. The thickness of the web is computed from the wavelengths and the refractive index of the web in the device. The refractive index distribution of the widthwise direction of the web is stored in an operation part 8 of the light- interference thickness gauge, a refractive index corresponding to the scanning location of the measuring part 7 in the widthwise direction of the web is specified from the refractive index distribution, and the thickness of the web is computed through the use of the refractive index.

    FILM THICKNESS MEASURING METHOD AND MANUFACTURING METHOD FOR SHEET

    公开(公告)号:JP2003240515A

    公开(公告)日:2003-08-27

    申请号:JP2002038375

    申请日:2002-02-15

    Abstract: PROBLEM TO BE SOLVED: To provide a film thickness measuring method using optical interference, in which a high-precision measurement is possible with a single measuring instrument even if a measurement range for an object is wide. SOLUTION: The film thickness of an object, which is to be measured, is acquired from an interference waveform which is acquired by spectroscopy, for each wavelength, of reflection light or transmission light from the object which is irradiated with light. The number of acquired extreme values of interference waveform or amplitude of the interference waveform is compared to a preset reference value, and depending on the result, one film-thickness calculation method is selected from among a plurality of different film-thickness calculation methods, for film thickness calculation. COPYRIGHT: (C)2003,JPO

    METHOD AND APPARATUS FOR MANUFACTURING PRINTING BASE SHEET FOR THERMAL STENCIL

    公开(公告)号:JP2000177263A

    公开(公告)日:2000-06-27

    申请号:JP35440498

    申请日:1998-12-14

    Abstract: PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a printing base sheet for a thermal stencil having a plastic film of a uniform thickness in the base sheet for the stencil manufactured by adhering a porous support made of synthetic fiber to one side of the film without adhesive and co-orienting it. SOLUTION: In the method for manufacturing a printing base sheet for a thermal stencil for obtaining a composite film by sequentially conducting a casting step of discharging a synthetic resin from a mouthpiece and casting a plastic film, an adhering step of adhering a porous support made of synthetic fibers to one surface of the film without adhesive, and a co-orienting step of co-orienting the film and the support, a plastic film thickness measuring step of measuring a thickness of only the plastic film of the composite film is provided after the co-orienting step, and the thickness of the plastic film is controlled by feeding back thickness information in its width direction to the casting step. The apparatus for manufacturing the base sheet for a thermal stencil by the method is provided.

    APPARATUS FOR DETECTING DEFECT OF FILM AND MANUFACTURE FOR FILM

    公开(公告)号:JPH08338814A

    公开(公告)日:1996-12-24

    申请号:JP16830495

    申请日:1995-06-09

    Abstract: PURPOSE: To accurately detect a pin hole of a small diameter of a light permeable film, by arranging an ultrasonic light source at the side of one face of the film and a photodetecting part having an image pickup device at the side of the other face of the film. CONSTITUTION: An ultrasonic light source 3 is arranged at the side of one face of a film 1, and a photodetecting part 4 having a built-in solid image pickup device 5 is set at the side of the other face of the film 1. Most of the ultraviolet rays from the light source 3 are reflected and absorbed by the film 1, not penetrating to the photodetecting part 4. Meanwhile, if a pin hole 2 is present on the film 1, the ultraviolet rays pass through the pin hole to reach the photodetecting part 4, are converted to an image signal by the device 5 and processed at a signal-processing device 6. As a result, the pin hole 2 is detected. Even women the film 1 shows a high permeability to visible lights, the ultraviolet rays are generally low in transmission and therefore the amount of ultraviolet rays passing through the pin hole 2 is greatly different from that of ultraviolet rays passing through other parts than the pin hole 2. The pin hole 2 is accordingly judged surely.

    SHEET DEFECT INSPECTING DEVICE AND SHEET MANUFACTURING METHOD

    公开(公告)号:JP2002310924A

    公开(公告)日:2002-10-23

    申请号:JP2001118397

    申请日:2001-04-17

    Abstract: PROBLEM TO BE SOLVED: To provide a sheet defect inspecting device with high accuracy in distinguishing defects capable of highly accurately determining the size of defects, especially pinhole, membrane, and air bubble defects which occur on a sheet, highly accurately distinguishing the defects, and reducing over detection of the defects. SOLUTION: In the defect inspecting device for detecting defect signals from among signals outputted from a light receiving part, a light source is arranged on one surface side of the sheet transferred by a sheet transfer means, and the light receiving part with an image pickup element is arranged on the other surface side. A plate for correcting the quantity of light is provided between the light source and the sheet.

    INSTRUMENT FOR MEASURING FILM THICKNESS

    公开(公告)号:JP2001280921A

    公开(公告)日:2001-10-10

    申请号:JP2000097144

    申请日:2000-03-31

    Abstract: PROBLEM TO BE SOLVED: To provide a film thickness measuring instrument capable of carrying out precise film thickness measurement by providing a converging device for converging an infrared beam and by using a light interference system, and provide a film manufacturing method using the instrument. SOLUTION: The infrared beam 2 output from a light parallelizing optical system 4 in a projection part is made to get incident into a film using the thin film thickness measuring instrument 30 arranged, in order, with a light source 1 for outputting the infrared beam, the light parallelizing optical system 4 in the projection part, a light converging device 6 for converging the infrared beam, a light parallelizing optical system 7 in a photoreceiving part, a diffraction grating 8, a linear image sensor 10 and a computing means 11. A reflected beam from the film is received by the converging device 6, the light output from the device 6 is brought into parallel light by the parallelizing optical system 7, and it is separated into its spectral components by the grating 8. The light separated into the spectral components by the grating 8 is detected by the linear image sensor 10 as a spectrum of light intensity in each wavelength to be converted into an electric signal, and a film thickness is found by the computing means 11.

    FILM THICKNESS MEASURING METHOD AND SHEET MANUFACTURING METHOD

    公开(公告)号:JP2002243415A

    公开(公告)日:2002-08-28

    申请号:JP2001039928

    申请日:2001-02-16

    Abstract: PROBLEM TO BE SOLVED: To provide a film thickness measuring method by optical interference that can execute measurement with high accuracy even when a measured object has double refraction and an interference spectral spectrum is distorted. SOLUTION: An optical spectrum at a measuring point on a sheet is measured and a wavelength that gives an extreme value of this optical spectrum is then determined. An estimated film thickness is determined and an interference order of the wavelength that gives the extreme value of the optical spectrum is then determined. A film thickness of a sheet is calculated based on the wavelength that gives the extreme value and the interference order.

Patent Agency Ranking