RESIN FILM MANUFACTURING METHOD
    1.
    发明专利

    公开(公告)号:JP2002326242A

    公开(公告)日:2002-11-12

    申请号:JP2001134037

    申请日:2001-05-01

    Abstract: PROBLEM TO BE SOLVED: To provide a resin film manufacturing method capable of stably manufacturing a resin film of high quality at a high speed by properly adjusting the thickness of the water film of a casting drum. SOLUTION: The casting drum 1, a resin supply device 2 for supplying a molten resin 2a to the casting drum 1, a water film forming device 10 for forming the water film on the casting drum 1 and a water film measuring instrument 20 for measuring the thickness of the water film on the casting drum 1 are provided. The water film forming device 10 adjusts the thickness of the water film formed on the casting drum 1 on the basis of the measuring result of the water film measuring instrument 20. The water film measuring instrument 20 is arranged at the position where the water film is interposed between the casting drum 1 and the resin film 2b.

    INSTRUMENT FOR MEASURING FILM THICKNESS

    公开(公告)号:JP2001280921A

    公开(公告)日:2001-10-10

    申请号:JP2000097144

    申请日:2000-03-31

    Abstract: PROBLEM TO BE SOLVED: To provide a film thickness measuring instrument capable of carrying out precise film thickness measurement by providing a converging device for converging an infrared beam and by using a light interference system, and provide a film manufacturing method using the instrument. SOLUTION: The infrared beam 2 output from a light parallelizing optical system 4 in a projection part is made to get incident into a film using the thin film thickness measuring instrument 30 arranged, in order, with a light source 1 for outputting the infrared beam, the light parallelizing optical system 4 in the projection part, a light converging device 6 for converging the infrared beam, a light parallelizing optical system 7 in a photoreceiving part, a diffraction grating 8, a linear image sensor 10 and a computing means 11. A reflected beam from the film is received by the converging device 6, the light output from the device 6 is brought into parallel light by the parallelizing optical system 7, and it is separated into its spectral components by the grating 8. The light separated into the spectral components by the grating 8 is detected by the linear image sensor 10 as a spectrum of light intensity in each wavelength to be converted into an electric signal, and a film thickness is found by the computing means 11.

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