公开(公告)号：DE69827429D1

公开(公告)日：2004-12-16

申请号：DE69827429

申请日：1998-05-15

Applicant: TORAY INDUSTRIES

Inventor： YUBA TOMOYUKI ,  ISHIKAWA YOSHIHIRO ,  ASANO MASAYA

IPC: C08G73/10 ,  G03F7/037 ,  G03F7/038

Abstract: An actinic radiation sensitive polymer composition containing (a) a polyimide precursor obtainable by the interaction of an amine compound having a photocrosslinking group with carboxyl groups of a poly(amic acid) chain, and (b) a photoinitiator and/or photosensitizer, in which the degree of imidization Ia is 0.03 ≤ Ia ≤ 0.6, has the characteristic features of both good stability of viscosity with lapse of time and good photosensitive performance.

公开(公告)号：DE69827429T2

公开(公告)日：2005-11-10

申请号：DE69827429

申请日：1998-05-15

Applicant: TORAY INDUSTRIES

Inventor： YUBA TOMOYUKI ,  ISHIKAWA YOSHIHIRO ,  ASANO MASAYA

IPC: C08G73/10 ,  G03F7/037 ,  G03F7/038

Abstract: An actinic radiation sensitive polymer composition containing (a) a polyimide precursor obtainable by the interaction of an amine compound having a photocrosslinking group with carboxyl groups of a poly(amic acid) chain, and (b) a photoinitiator and/or photosensitizer, in which the degree of imidization Ia is 0.03 ≤ Ia ≤ 0.6, has the characteristic features of both good stability of viscosity with lapse of time and good photosensitive performance.

公开(公告)号：JP2000058535A

公开(公告)日：2000-02-25

申请号：JP14484499

申请日：1999-05-25

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  ISHIKAWA YOSHIHIRO

IPC: H01L21/312 ,  C08K3/36 ,  C08K5/17 ,  C08L79/08

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor element comprising an insulating film or protective film which, excellent in etching-resistance in a nitric-acid fluoride solution, has less metal ion such as sodium ion that affects on a device. SOLUTION: On a substrate, a film wherein a polyimide precursor composition whose main components are (1) polyamide acid, (2) a compound comprising tertiary amino group, and (3) a colloidal silica is heated is so formed that the surface of substrate is selectively exposed, and the exposed part is etched with nitrohydrofluoric acid, with the heated film used as an insulating film or protective film. Here, the content of sodium ion of the heat-treatment film before etching is 10 ppm or less.

公开(公告)号：JPH1130862A

公开(公告)日：1999-02-02

申请号：JP13339398

申请日：1998-05-15

Applicant: TORAY INDUSTRIES

Inventor： YUMIBA TOMOYUKI ,  ISHIKAWA YOSHIHIRO ,  ASANO MASAYA

IPC: G03F7/027 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  G03F7/038 ,  G03F7/075

Abstract: PROBLEM TO BE SOLVED: To obtain a polymer compsn. having both good stability of the viscosity at room temp. with time and the photosensitive performance by controlling the imidization degree and the number of photo-crosslinking groups of a polyamide acid. SOLUTION: The compsn. contains a polyimide precursor prepared by the reaction of carboxyl groups of a polyamide acid and an amine compd. having photo-crosslinking groups, and a photo initiator and/or a photosensitizer. The imidization degree Ia of the polymer in the compsn. is controlled to 0.03 is a tri or quadrivalent org. group having 2 carbon atoms, R is a bivalent org. group having 2 carbon atoms, and K is 0 or 1. In formula II, R , R , R are independently hydrogen or 1 to 30C org. groups, and at least one of them is an org. group having a photo-crosslinking group.

公开(公告)号：JPH1115152A

公开(公告)日：1999-01-22

申请号：JP17048597

申请日：1997-06-26

Applicant: TORAY INDUSTRIES

Inventor： ISHIKAWA YOSHIHIRO ,  ASANO MASAYA ,  MIURA YASUO

IPC: G03F7/027 ,  C08F2/48 ,  C08F290/06 ,  C08L79/08 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To enable good pattern formation capable of shortening a developing time while keeping sufficient sensitivity by incorporating a product obtained by a specified polyamic acid and an ethylenically unsaturated compound and a photopolymerization initiator. SOLUTION: The photoconductive polyimide precursor composition contains a product obtained by reaction of a part of carboxy acid groups of the polyamic acid having an alcohol acid ester on at least one of the terminals of the molecule with an isocyanate compound or a glycidyl compound, and a compound having an ethylenically unsaturated group and a photopolymerization initiator. The polyamic acid having the alcohol acid ester on the terminal of the molecule is represented by formula in which R1 is a 2-22C tetravalent organic group; R2 is a 1-15C univalent organic group having no unsaturated group or a 3-15C univalent organic group; R3 is a 1-22C divalent organic group; and (n) is an integer of >=0.

公开(公告)号：JPH11338167A

公开(公告)日：1999-12-10

申请号：JP14585098

申请日：1998-05-27

Applicant: TORAY INDUSTRIES

Inventor： ISHIKAWA YOSHIHIRO ,  TOMIKAWA MASAO

IPC: G03F7/027 ,  G03F7/038 ,  G03F7/30 ,  G03F7/40 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a patterning result without any problem for accommodating wafer cassette after a developing step of photosensitive polyimide. SOLUTION: A patterning process is characterized in that a thermal processing step is carried out with a hotplate after the end of a development step in a single wafer development process and that a photosensitive polyimide precursor compsn. is coated on a substrate, dried and fed to a developing line for each wafer.

公开(公告)号：JPH10339958A

公开(公告)日：1998-12-22

申请号：JP14803097

申请日：1997-06-05

Applicant: TORAY INDUSTRIES

Inventor： FUJIMOTO KOJI ,  MIURA YASUO ,  ISHIKAWA YOSHIHIRO

IPC: G03F7/32 ,  C11D7/26 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To obtain the rinse solution for the photosensitive polyimide usable safely in a development rinse process without any danger of causing ignition in an explosion-nonpreventing equipment by using the rinse solution containing water and an organic solvent miscible with water in an optional rate and having no ignition point. SOLUTION: The rinse solution contains water and the organic solvent miscible with water in an optional rate and having the solvent to water mixing proportion in which the ignition point does not exist. It is preferred to select a proportion of the organic solvent to water in the range of 80/20-5/95, further 70/30-15/85. Thus permitting the ignition point to be removed and a danger of ignition in the rinse process to be eliminated and the development rinse operation to be executed safely in the apparatus provided with no explosion preventive device.

公开(公告)号：JPH07133428A

公开(公告)日：1995-05-23

申请号：JP19831093

申请日：1993-08-10

Applicant: TORAY INDUSTRIES

Inventor： ISHIKAWA YOSHIHIRO ,  SAITO SHOJI ,  ASANO MASAYA

IPC: G03F7/039 ,  C08K5/06 ,  C08L79/08 ,  H01L21/312

Abstract: PURPOSE:To obtain the composition providing a high-quality coating film having uniformity and flatness free from undulation, coating defects, orange peel, etc., without impairing adhesion to a sealing resin, etc., by blending a polyamic acid with a specific surfactant. CONSTITUTION:This composition contains (A) a polyamic acid containing a unit of formula 1 (R is a 22C tri- or tetrafunctional organic group; R is a >=2C bifunctional organic group; R is monofunctional organic group, H, etc.; (n) is 1 or 2) (preferably one synthesized from pyromellitic dianhydride and 4,4'-diaminodiphenyl ether) and (B) a surfactant of formula II ((m), (p) and (n) are 1-100) in the ratio of preferably 0.001-0.1 pt.wt. of the component B based on 100 pts.wt. of the component A. When the polyamic acid of formula I or a polyamic acid ester containing at least one molecular end which is made into an acid ester of an alcoholic OH-containing acrylic ester such as glycerol acrylate is used as the component A, excellent photosensitive characteristics are preferably obtained.

公开(公告)号：JP2000063519A

公开(公告)日：2000-02-29

申请号：JP14484599

申请日：1999-05-25

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  ISHIKAWA YOSHIHIRO

IPC: H01L21/312 ,  C08F2/50 ,  C08F290/14 ,  C08F299/02 ,  C08G73/10 ,  C08L79/08

Abstract: PROBLEM TO BE SOLVED: To obtain a polyimide precursor composition sufficiently with standing even the etching process on a substrate surface, and suitably usable as a protective film or insulating film for semiconductors by making the composition include a polyamide acid and a specific reaction product. SOLUTION: This composition is obtained by including (A) a polyamic acid, (B) a reaction product from a tetracarboxylic acid dianhydride and an aminoalkoxysilane, and, as necessary, (C) a compound having photoreactive ethylenically unsaturated bond and amino group, and (D) a photopolymerization initiator; wherein the component A is such a compound as to be prepared, for example, by dissolving a diamine in an aprotic polar solvent (e.g. N-methyl-2- pyrrolidone) followed by addition of a tetracarboxylic acid dianhydride to afford a viscous solution; the tetracarboxylic acid dianhydride is pref. a compound of the formula (R1 is a 2-22C tetravelent organic group), and the diamine is pref. a compound of the formula H2N-R2-NH2 (R2 is a 1-22C bivalent organic group).

公开(公告)号：JPH11340218A

公开(公告)日：1999-12-10

申请号：JP14584998

申请日：1998-05-27

Applicant: TORAY INDUSTRIES

Inventor： ISHIKAWA YOSHIHIRO ,  TOMIKAWA MASAO

IPC: G03F7/40 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/312

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, whereby when a heating operation is further included after a heating operation for imidizing a polyimide antecedent in a step for manufacturing a semiconductor device, pollutants on a substrate such as a silicon wafer are removed through the vaporization of an organic components in the post processes. SOLUTION: A method for manufacturing a semiconductor device, whereby a postprocessing of heating the semiconductor is included after a photosensitive polyimide antecedent has been applied, exposed, developed, and heated on the semiconductor device, includes a step of removing the components, which have stuck to a pad or to the back of a patterned surface during the heating operation of the post process, by using an etching method.