公开(公告)号：JP2003105167A

公开(公告)日：2003-04-09

申请号：JP2001300159

申请日：2001-09-28

Applicant: TORAY INDUSTRIES

Inventor： YAMAMOTO TETSUYA ,  KITAMURA TOMOHIRO ,  SUZUKI YOSHIO

IPC: C08J5/18 ,  C08G59/14 ,  C08K3/22 ,  C08L13/00 ,  C08L61/06 ,  C08L63/00 ,  C09J7/00 ,  C09J109/02 ,  C09J161/14 ,  C09J163/00 ,  C09J163/02 ,  C09J163/04

Abstract: PROBLEM TO BE SOLVED: To provide a flame-retardant resin composition which exhibits good flame retardance and, simultaneously, excels in adhesion, soldering heat resistance, and lamination fabricability, and an adhesive sheet for semiconductor devices, a cover lay film, and a flexible printed circuit board. SOLUTION: The flame-retardant resin composition comprises (A) an epoxy resin having phosphorus in the molecule, and (B) a triazine modified phenol novolak resin. The adhesive sheet for semiconductor devices has an adhesive layer composed of the flame-retardant resin composition, and at least one layer of a releasable protective film layer. The cover lay film is constituted of a laminate of an insulating film coated with the above flame-retardant resin composition, and a releasable protective film layer. The flexible printed circuit board is obtained by adhering an insulating layer to a copper foil through an adhesive layer composed of the above flame-retardant resin composition.

公开(公告)号：JP2002275240A

公开(公告)日：2002-09-25

申请号：JP2001076603

申请日：2001-03-16

Applicant: TORAY INDUSTRIES

Inventor： TABATA AKIHIRO ,  KITAMURA TOMOHIRO ,  TOKUNAGA ATSUTO

IPC: C08K3/00 ,  C08G59/24 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reliability to release resistance and blistering property, etc., in reflow and packing property in molding. SOLUTION: This epoxy-based resin composition comprises (A) an epoxy resin, (B) a curing agent and (C) filler. The epoxy-based resin composition is characterized in that a ratio of the filler (C) is 88-96 wt.% based on total resin composition and the epoxy resin comprises (a) a bisphenol F type epoxy resin represented by the chemical formula (I) and a tetramethylbisphenol F type epoxy resin represented by the chemical formula (II).

公开(公告)号：EP1640428A4

公开(公告)日：2009-02-11

申请号：EP04746707

申请日：2004-06-23

Applicant: TORAY INDUSTRIES

Inventor： YAMAMOTO TETSUYA ,  KITAMURA TOMOHIRO ,  SUZUKI SACHIO

IPC: C09J163/00 ,  B32B7/12 ,  B32B15/08 ,  C08G59/16 ,  C08G59/30 ,  C09J7/00 ,  H05K1/00 ,  H05K3/28 ,  H05K3/38

CPC classification number: B32B7/12 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/281 ,  B32B2250/03 ,  B32B2270/00 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/1472 ,  C08G59/304 ,  C09J7/10 ,  C09J163/00 ,  C09J2461/00 ,  C09J2463/00 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  Y10T428/1471 ,  Y10T428/2804 ,  Y10T428/287

Abstract: An adhesive composition for semiconductor devices which comprises an epoxy resin, a phenoxy resin, and a hardener, wherein part or all of the epoxy resin comprises at least one type of epoxy resin selected from the followings: (a) a dimer acid modified epoxy resin (b) a phosphorus containing epoxy resin having an epoxy equivalent of 2000 to 6000. Said adhesive composition has satisfactory flexural properties even in a high-temperature environment while retaining an excellent toughness of the adhesive and is excellent in soldering heat resistance, adhesive property, flame retardancy and electrical properties. The adhesive composition can suitable be used for cover lay films, adhesive sheets and copper-clad polyimide films.

公开(公告)号：JP2003119392A

公开(公告)日：2003-04-23

申请号：JP2001259207

申请日：2001-08-29

Applicant: TORAY INDUSTRIES

Inventor： KITAMURA TOMOHIRO ,  YAMAMOTO TETSUYA ,  SUZUKI YOSHIO

IPC: B32B15/08 ,  C08K3/32 ,  C08K5/16 ,  C08K5/49 ,  C08L61/34 ,  C08L101/00 ,  C09J7/02 ,  C09J11/00 ,  C09J201/00 ,  H01L21/60 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a non-halogenated flame-retardant resin composition which exhibits good flame retardancy and has excellent adhesiveness, solder heat resistance, insulating characteristics and tackiness, and to provide a flexible printed circuit substrate, a semiconductor adhesive sheet, and a cover lay film which each uses the non-halogenated flame-retardant resin composition. SOLUTION: This flame retardant resin composition containing (A) a phosphorous flame retardant and (B) a nitrogen-based flame retardant as essential components is characterized by satisfying the expressions: 7 =1, wherein a phosphorus content is (a) wt.%, and a nitrogen content is (b) wt.%.

公开(公告)号：JP2002348353A

公开(公告)日：2002-12-04

申请号：JP2002079671

申请日：2002-03-20

Applicant: TORAY INDUSTRIES

Inventor： TABATA AKIHIRO ,  KITAMURA TOMOHIRO ,  TOKUNAGA ATSUTO

IPC: C08K3/00 ,  C08G59/24 ,  C08G59/38 ,  C08G59/62 ,  C08K5/54 ,  C08K5/541 ,  C08L63/00 ,  C08L101/04 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reliability such as soldering heat resistance, adhesion and the like, and molding properties such as filling properties in molding, curing properties and the like. SOLUTION: The epoxy resin composition comprises an epoxy resin (A), a curing agent (B) and a filler (C), where the epoxy resin (A) contains an epoxy resin (a) represented by chemical formula (I) and an epoxy resin (b) represented by chemical formula (II) and the filler (C) accounts for 85-96 wt.% in the whole resin composition.

公开(公告)号：JP2002294028A

公开(公告)日：2002-10-09

申请号：JP2001097040

申请日：2001-03-29

Applicant: TORAY INDUSTRIES

Inventor： TABATA AKIHIRO ,  KITAMURA TOMOHIRO ,  OTSU TAKASHI

IPC: C08L63/00 ,  C08G59/24 ,  C08G59/62 ,  C08K3/00 ,  C08L77/00 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin having excellent reliability during reflow and filling property during molding. SOLUTION: The epoxy resin composition contains an epoxy resin (A), a hardener (B), a filler (C) and a polyamide resin (D).

公开(公告)号：JP2006351676A

公开(公告)日：2006-12-28

申请号：JP2005173509

申请日：2005-06-14

Applicant: TORAY INDUSTRIES

Inventor： KITAMURA TOMOHIRO ,  YAMAMOTO TETSUYA

IPC: H05K3/28 ,  B32B27/00

Abstract: PROBLEM TO BE SOLVED: To provide a cover lay film which has superior adhesion with an interlayer adhesive layer, and a composite board using the film. SOLUTION: The cover lay film has an insulating film, an adhesive layer made of an adhesive composition for a semiconductor device and a peelable protective film, and the average surface roughness (Ra) of a surface without the adhesive layer in the insulating film is 0.05 μm or more. COPYRIGHT: (C)2007,JPO&INPIT