公开(公告)号：SG11201706068QA

公开(公告)日：2017-08-30

申请号：SG11201706068Q

申请日：2016-01-25

Applicant: TORAY INDUSTRIES

Inventor： YUBA TOMOYUKI ,  MASUDA YUKI ,  JIN JIAKE ,  LI PING

IPC: C08G73/10 ,  C07C41/22 ,  C07C43/225 ,  C07C209/74 ,  C07C211/52 ,  C07C231/02 ,  C07C231/12 ,  C07C233/43 ,  C07D209/48 ,  C07D263/62 ,  C08L79/08 ,  G03F7/023 ,  H01L21/027 ,  H05K3/28

Abstract: Provided is a resin which has a low linear thermal expansion coefficient and a low absorbance. This resin is characterized by comprising at least one structure that is selected from among structures represented by general formula (1) or (2).